Loading-mode-dependent deformation mechanisms of sintered porous Cu

Journal Article (2026)
Author(s)

Chenshan Gao (Southern University of Science and Technology )

L. Du (TU Delft - Electrical Engineering, Mathematics and Computer Science)

Tianxing Du (Student TU Delft)

Qihang Zong (Southern University of Science and Technology )

Shizhen Li (Southern University of Science and Technology )

Huiru Yang (Shenzhen Polytechnic University)

G.Q. Zhang (Southern University of Science and Technology )

H. Ye (Southern University of Science and Technology , TU Delft - Electrical Engineering, Mathematics and Computer Science)

Research Group
Electronic Components, Technology and Materials
DOI related publication
https://doi.org/10.1016/j.matdes.2026.116856 Final published version
More Info
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Publication Year
2026
Language
English
Research Group
Electronic Components, Technology and Materials
Journal title
Materials and Design
Volume number
270
Article number
116856
Downloads counter
21
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Abstract

Sintered porous Cu contains a heterogeneous particle-neck-pore architecture whose deformation depends strongly on loading mode. In this study, porous Cu structures prepared from small particles (184 nm) and large particles (1451 nm) were examined using micropillar compression, micro-cantilever bending, scanning electron microscopy (SEM), transmission electron microscopy (TEM), and molecular dynamics (MD) simulations. Under compression, the large-particle structure exhibited a higher apparent elastic modulus (14.5 ± 0.9 GPa) than the small-particle structure (12.7 ± 0.5 GPa), whereas the small-particle structure showed an approximately 80% higher yield strength (364 ± 58 versus 202 ± 71 MPa). In contrast, the large-particle structure exhibited an approximately 245% higher conditional fracture toughness (5.56 ± 0.14 versus 1.61 ± 0.16 MPa⋅m1/2) and 1270% higher total bending work (8823 ± 1245 versus 644 ± 164 pJ). Microstructural analyses revealed that the refined particle-neck network accommodated compression through distributed pore compaction, neck deformation, and dislocation accumulation, suppressing strain localization. The coarser network promoted intraparticle slip and interfacial sliding under compression, while enhancing remaining-ligament continuity and neck bridging during crack propagation. MD simulations reproduced these distinct compressive responses and defect-evolution characteristics. These findings provide guidance for optimizing particle-neck-pore architectures in reliable sintered Cu interconnects.