This study presents a new design for localized metallic sintering using microheaters on a glass substrate. By applying controlled pulse currents, the microheaters generate focused heat pulses that enable rapid, localized sintering while keeping nearby device components at room temperature. This approach reduces thermal stress caused by thermal expansion mismatches, as sintering is completed within seconds. Compared to conventional techniques, it improves efficiency, lowers power consumption, and provides precise control over the sintered areas. This method offers a promising alternative for microelectronics packaging and integration, particularly in applications requiring careful thermal management. The microheaters are also successfully fabricated for later experimental validation of this novel design.