Research on Design Optimization of Temperature and Current Sharing Uniformity of SiC HybridPACK Drive Power Modules Under Multi-Physics Coupling

Abstract

The rapid expansion of the electric vehicle industry has accelerated the adoption of Silicon Carbide (SiC) HybridPACK Drive (HPD) power modules to meet the escalating demand for high-efficiency power conversion. However, under high power density conditions, these modules encounter significant reliability challenges stemming from intricate multi-physics interactions across electrical, thermal, and mechanical domains. This study employs multi-physics simulations to systematically evaluate the synergistic effects of several critical design variables—including pin-fin geometry and gradient arrangements, die-attach materials and processes, and chip interconnection structures—on the module’s temperature and current-sharing uniformity. Based on the simulation results, an optimal configuration was identified for sample fabrication and experimental validation. By correlating empirical measurements with simulation data, this research elucidates the configurations that provide superior performance under constant heat flux conditions. The findings establish a robust theoretical and practical framework for enhancing the reliability and operational consistency of SiC HPD power modules through multi-factor comprehensive optimization.