Failure analysis and reliability of low-temperature-grown multi-wall carbon nanotube bundles integrated as vias in monolithic three-dimensional integrated circuits

Journal article (2014)

Authors

AN Chiaramonti External organisation
S. Vollebregt Electronic Components, Technology and Materials - EEMCS
AW Sanders External organisation
R. Ishihara Electronic Components, Technology and Materials - EEMCS
DT Read External organisation
Research Group
Electronic Components, Technology and Materials (EEMCS) (TU Delft)
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Published Date

2014

Language

English

Reuse Rights

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials