Failure analysis and reliability of low-temperature-grown multi-wall carbon nanotube bundles integrated as vias in monolithic three-dimensional integrated circuits
Journal Article
(2014)
Author(s)
AN Chiaramonti (External organisation)
Sten Vollebregt (TU Delft - Electronic Components, Technology and Materials)
AW Sanders (External organisation)
R. Ishihara (TU Delft - Electronic Components, Technology and Materials)
DT Read (External organisation)
Research Group
Electronic Components, Technology and Materials
DOI related publication
https://doi.org/10.1017/S143192761401054X
To reference this document use:
https://resolver.tudelft.nl/uuid:bd6e3be1-9813-43fe-8941-798f61990fde
More Info
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Publication Year
2014
Language
English
Research Group
Electronic Components, Technology and Materials
Issue number
Suppl. 3
Volume number
20
Pages (from-to)
1762-1763
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