Failure analysis and reliability of low-temperature-grown multi-wall carbon nanotube bundles integrated as vias in monolithic three-dimensional integrated circuits

Chiaramonti, AN; Vollebregt, S; Sanders, AW; Ishihara, R; Read, DT

Failure analysis and reliability of low-temperature-grown multi-wall carbon nanotube bundles integrated as vias in monolithic three-dimensional integrated circuits

Journal article (2014)

Authors

AN Chiaramonti External organisation

S Vollebregt Electronic Components, Technology and Materials

AW Sanders External organisation

R Ishihara Electronic Components, Technology and Materials

DT Read External organisation

Research Group

Electronic Components, Technology and Materials

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Published Date

2014

Language

English

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Research Group

Electronic Components, Technology and Materials

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