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AN Chiaramonti
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5 records found
Integrating carbon nanotubes as vias in a monolithic 3DIC process
Conference paper -
S. Vollebregt
,
R. Ishihara
,
AN Chiaramonti
,
J. van der Cingel
,
C.I.M. Beenakker
Contact resistance of low-temperature carbon nanotube vertical interconnects
Conference paper -
S. Vollebregt
,
AN Chiaramonti
,
R. Ishihara
,
H. Schellevis
,
C.I.M. Beenakker
Towards the integration of carbon nanotubes as vias in monolithic three-dimensional integrated circuits
Journal article -
S. Vollebregt
,
AN Chiaramonti
,
J. van der Cingel
,
C.I.M. Beenakker
,
R. Ishihara
Dominant thermal boundary resistance in multi-walled carbon nanotube bundles fabricated at low temperature
Journal article -
S. Vollebregt
,
S Banerjee
,
AN Chiaramonti
,
F.D. Tichelaar
,
C.I.M. Beenakker
,
R. Ishihara
Failure analysis and reliability of low-temperature-grown multi-wall carbon nanotube bundles integrated as vias in monolithic three-dimensional integrated circuits
Journal article -
AN Chiaramonti
,
S. Vollebregt
,
AW Sanders
,
R. Ishihara
,
DT Read