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AN Chiaramonti
Academic Work (5)
Conference paper (2)
Journal article (3)
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5 records found
1
Dominant thermal boundary resistance in multi-walled carbon nanotube bundles fabricated at low temperature
Journal article (2014) -
S. Vollebregt (author)
,
S Banerjee (author)
,
AN Chiaramonti (author)
,
F.D. Tichelaar (author)
,
C.I.M. Beenakker (author)
,
R. Ishihara (author)
Failure analysis and reliability of low-temperature-grown multi-wall carbon nanotube bundles integrated as vias in monolithic three-dimensional integrated circuits
Journal article (2014) -
AN Chiaramonti (author)
,
S. Vollebregt (author)
,
AW Sanders (author)
,
R. Ishihara (author)
,
DT Read (author)
Towards the integration of carbon nanotubes as vias in monolithic three-dimensional integrated circuits
Journal article (2013) -
S. Vollebregt (author)
,
AN Chiaramonti (author)
,
J. van der Cingel (author)
,
C.I.M. Beenakker (author)
,
R. Ishihara (author)
Contact resistance of low-temperature carbon nanotube vertical interconnects
Conference paper (2012) -
S. Vollebregt (author)
,
AN Chiaramonti (author)
,
R. Ishihara (author)
,
H. Schellevis (author)
,
C.I.M. Beenakker (author)
Integrating carbon nanotubes as vias in a monolithic 3DIC process
Conference paper (2012) -
S. Vollebregt (author)
,
R. Ishihara (author)
,
AN Chiaramonti (author)
,
J. van der Cingel (author)
,
C.I.M. Beenakker (author)