Flat Lens-in-Package Architecture Using Multi-Axis Machining in D-Band
N. van Rooijen (TU Delft - Tera-Hertz Sensing)
M. Alonso Del Pino (TU Delft - Tera-Hertz Sensing)
J. Bueno Lopez (TU Delft - Electronics)
Nuria Llombart (TU Delft - Tera-Hertz Sensing)
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Abstract
This work presents an electrically-small lens that has been redesigned towards a flat interface. This way, the lens is easier to integrated, compared to an earlier introduced spherical core-shell lens concept. The lens is created from a single dielectric host material by conformally machining holes into the material. In this process, two artificial dielectric layers are created; The first layer is used for anti-reflection purposes, whereas the second is used to convert the spherical interface to a flat interface. The two layers enable the use of holes with lower aspect ratio drilling, compared to classical gradient-index lenses. The lens is designed to operate in the 140-170 GHz bandwidth, and a prototype with height of only 2.2 mm and diameter of 6.6 mm was fabricated and characterize. The prototype is small enough to fit in many integrated circuit packages. The flat lens was compared to a non-flat core lens in terms of pattern quality, return loss and dielectric loss, with only negligible performance degradation.
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