Vertical die crack stresses of Flip Chip induced in major package assembly processes
Journal Article
(2000)
Author(s)
DG Yang (External organisation)
L.J. Ernst (TU Delft - Dynamics of Micro and Nano Systems)
C van t Hof (TU Delft - Dynamics of Micro and Nano Systems)
MS Kiasat (TU Delft - Dynamics of Micro and Nano Systems)
et. et. al. (External organisation)
Research Group
Dynamics of Micro and Nano Systems
To reference this document use:
https://resolver.tudelft.nl/uuid:c3720b9f-90d7-42bb-8563-39742dd31143
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Publication Year
2000
Research Group
Dynamics of Micro and Nano Systems
Volume number
40
Pages (from-to)
1533-1538
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