Vertical die crack stresses of Flip Chip induced in major package assembly processes

Journal Article (2000)
Author(s)

DG Yang (External organisation)

Leo Ernst (TU Delft - Dynamics of Micro and Nano Systems)

C van t Hof (TU Delft - Dynamics of Micro and Nano Systems)

MS Kiasat (TU Delft - Dynamics of Micro and Nano Systems)

al et al (External organisation)

Research Group
Dynamics of Micro and Nano Systems
More Info
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Publication Year
2000
Research Group
Dynamics of Micro and Nano Systems
Volume number
40
Pages (from-to)
1533-1538

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