Vertical die crack stresses of Flip Chip induced in major package assembly processes

Yang, DG; Ernst, L.J.; van t Hof, C; Kiasat, MS; al., et.

Vertical die crack stresses of Flip Chip induced in major package assembly processes

Journal article (2000)

Authors

DG Yang External organisation

L.J. Ernst Dynamics of Micro and Nano Systems

C van t Hof Dynamics of Micro and Nano Systems

MS Kiasat Dynamics of Micro and Nano Systems

et. al. External organisation

Research Group

Dynamics of Micro and Nano Systems

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Published Date

2000

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Research Group

Dynamics of Micro and Nano Systems

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