On-chip isolation in wafer-level chip-scale packages: substrate thinning and circuit partitioning by trenches

Conference paper (2003)

Authors

SM Sinaga Old - EWI Ch. Integrated Sensing Devices

A Poliakov Old - EWI Ch. Integrated Sensing Devices

M. Bartek Old - EWI Ch. Integrated Sensing Devices

JN Burghartz Old - EWI Ch. Integrated Sensing Devices

Research Group

Old - EWI Ch. Integrated Sensing Devices

More Info

expand_more

To reference this document use:

http://resolver.tudelft.nl/uuid:d5f477a3-d3b7-4adf-a198-7cf95899401d

Published Date

2003

Language

Undefined/Unknown

Reuse Rights

Other than for strictly personal use, it is not permitted to download, forward or distribute the text or part of it, without the consent of the author(s) and/or copyright holder(s), unless the work is under an open content license such as Creative Commons.

Research Group

Old - EWI Ch. Integrated Sensing Devices