Copper Nanoparticle Sintering Enabled Hermetic Packaging With Fine Sealing Ring for MEMS Application
Dong Hu (TU Delft - Electrical Engineering, Mathematics and Computer Science)
Mustafeez Bashir Shah (TU Delft - BUS/Quantum Delft, Student TU Delft)
Jiajie Fan (TU Delft - Electrical Engineering, Mathematics and Computer Science)
Sten Vollebregt (TU Delft - Electrical Engineering, Mathematics and Computer Science)
Guoqi Zhang (TU Delft - Electrical Engineering, Mathematics and Computer Science)
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Abstract
Driving by the increased demand for hermetic packaging in the more than Moore (MtM) roadmap, a Cu nanoparticle sintering-enabled hermetic sealing solution was developed with a small-size sealing ring. The developed technology simplifies microfabrication and requires less surface roughness using a sinterable Cu nanoparticle paste. A 50μm size Cu paste sealing ring was achieved using a lithography patterned photoresist as a stencil mask. A groove-structured chip was used to amplify localized stress. The Cu nanoparticle paste was fully sintered at 300 °C under pressure ranging from 10 to 40 MPa resulting in a robust bonding with a maximum shear strength of 280 MPa and implementing hermetic packaging. The deflection of the Si diaphragms estimated a vacuum level of 7 kPa. Vacuum sealing was maintained for over six months, and the lowest leak rate was calculated as 8.4× 10
-13Pa·m
3/s. The developed technology that comprises small-size patterning and pressure-assisted sintering offers the potential for a simple, cost-effective, but robust solution for hermetic packaging.