EUROSERVER

Energy efficient node for European micro-servers

Conference paper (2014)

Authors

Yves Durand Université Grenoble Alpes
P. Carpenter Barcelona Supercomputing Center
Emil Matus Technische Universität Dresden
Iakovos Mavroidis Foundation for Research and Technology - Hellas (FORTH)
J. Thomson OnApp
Stefano Adami EUROTECH SPA
Angelos Bilas Foundation for Research and Technology - Hellas (FORTH)
Denis Dutoit Université Grenoble Alpes
Alexis Farcy STMicroelectronics SA, France
G. Gaydadjiev Chalmers University of Technology
Manolis Katevenis Foundation for Research and Technology - Hellas (FORTH)
Manolis Marazakis Foundation for Research and Technology - Hellas (FORTH)
Affiliation
External organisation
ARM System architecture Virtualization FD-SOI Three-dimensional (3D) integrated circuits
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Published Date

16-10-2014

Language

English

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Affiliation

External organisation

Abstract

EUROSERVER is a collaborative project that aims to dramatically improve data centre energy-efficiency, cost, and software efficiency. It is addressing these important challenges through the coordinated application of several key recent innovations: 64-bit ARM cores, 3D heterogeneous silicon-on-silicon integration, and fully-depleted silicon-on-insulator (FD SOI) process technology, together with new software techniques for efficient resource management, including resource sharing and workload isolation. We are pioneering a system architecture approach that allows specialized silicon devices to be built even for low-volume markets where NRE costs are currently prohibitive. The EUROSERVER device will embed multiple silicon 'chiplets' on an active silicon interposer. Its system architecture is being driven by requirements from three use cases: data centres and cloud computing, telecom infrastructures, and high-end embedded systems. We will build two fully integrated full-system prototypes, based on a common micro-server board, and targeting embedded servers and enterprise servers.