Air film based contactless planar positioning system with sub-micron precision

Conference paper (2011)

Authors

J. Wesselingh Mechatronic Systems Design - Mechanical, Maritime and Materials Engineering
J.W. Spronck Mechatronic Systems Design - Mechanical, Maritime and Materials Engineering
R.A.J. van Ostayen Mechatronic Systems Design - Mechanical, Maritime and Materials Engineering
J. van Eijk Mechatronic Systems Design - Mechanical, Maritime and Materials Engineering
Research Group
Mechatronic Systems Design (Mechanical, Maritime and Materials Engineering) (TU Delft)
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Published Date

2011

Language

English

Reuse Rights

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Faculty

Mechanical, Maritime and Materials Engineering

Department

Precision and Microsystems Engineering

Research Group

Mechatronic Systems Design

Abstract

This paper discusses a 6DoF positioning system that utilizes a thin air film to directly position flat substrates with sub-micrometer precision. Such a position system can be applied in the production of electronic devices, such as integrated circuits, flat panel displays and solar cells. All these devices are manufactured on a flat base substrate, e.g. a silicon wafer or glass plate. Precision positioning stages are used during exposure, inspection, alignment, etc. We present a planar positioning system where only the product mass is driven and without mechanical contact. This system has two main advantages: a moving mass of 2 to 3 orders of magnitude smaller, since the carrier stage is eliminated and the absence of mechanical contact reduces the chance of contamination or damage.