Typically, the transient thermal error accounts for up to 70 percent of the total error in machine tools and precision devices. To decrease the effect of thermal distortions, design optimization is used as tool to modify, e.g., the material thickness, structural shape and cooling. This paper presents a heuristic design optimization method relying on thermal modes. The method reduces the system using the most relevant modes, which are identified using three designer-based response functions. Although the method may not converge to the global optimum and may need some tuning of inputs, it results in manufacturable designs. In addition, the designer-based response functions give insight in the design. Thus, this heuristic optimization method is a good way to reduce the thermal error in the design of a thermo-mechanical system. Keywords: thermal error, thermo-mechanical, heuristic design, design optimization, thermal modal analysis@en

By definition, mechatronic systems involve coupled structural and control properties. Therefore, optimization of mechatronic systems requires an integral optimization of both. In this paper, we study the optimal design of a simplified motion control system. In particular, we develop a methodology which utilizes topology and shape optimization to create a parameterized structure and improve its dynamic characteristics. The obtained structure is used as a starting point for combined structural and control optimization. We compare performances of the systems optimized by sequential and nested optimization approaches. The nested optimization procedure results in a better final performance. Keywords: topology optimization, nested optimization, combined structural and control optimization, proportional-integral-derivative (PID) controller.@en

Traditionally, sequential approaches to structural and control optimization are used to improve the performance of mechatronic systems. However, the chances of finding a truly optimal system can be increased if structure and controller are optimized in a simultaneous, integral optimization procedure. Our research is focussing on combining topology optimization and controller optimization. The first step towards an integral system optimization approach is to study the mutual dependence between structural and control parameters, and their combined effect on a chosen performance measure. Furthermore, sensor and actuator placement are important factors in achieving optimal system behaviour, and should be considered in combination with the specific dynamic behaviour. In this paper, we study the optimal design of a simplified motion control system. In particular, we focus on a fundamental understanding of the interdependence between sensor position, structural eigenmodes and controlled system performance.@en

Reduced thermomechanical models are needed for the next generation precision devices. One of the methods is thermal modal analysis, which decomposes the behaviour into thermal modes and time constants. This study aims to measure these modal parameters. We isolated the behaviour of a single thermal mode exciting the system in the test set-up by this mode. The measured responses as well as the modal contributions are in good agreement with the simulations. Thus, thermal modal analysis can provide a basis for design optimiztion and compensation strategies.@en

A new contact-less transport system for thin and fragile products like silicon wafers is introduced. The product is carried on a thin film of air separating the product from the system, and is transported using the relative velocity of the pressurized and moving air film parallel and adjacent to the system surface. This innovative concept can produce both the high stiffness and acceleration required for high precision positioning and efficient product transport. In this paper the basic design principles of this system are presented. Experimental verification is demonstrated on a 6-dof planar air actuated high precision positioning stage.@en

Thermal errors are important sources of positioning errors in precision machines [1] and are more and more becoming determining factors to meet increasing specifications. In this paper, thermal modal analysis is used to study the behaviour of an industrial inkjet printer under thermal load and to develop a reduced order thermal error model while maintaining the precision. The reduction of transient thermal deformation by adding extra heat loads is analysed as a possible method to improve thermal behaviour of high precision printing systems. Two approaches are taken and their simulation results are compared.@en

Design sensitivities are used in various engineering methods to arrive at optimal or advanced designs. The design sensitivity of a system, also known as the derivative to a design variable, represents the change of the system response due to an adjustment of a design variable. Scientists and engineers often use modal design sensitivities to predict the change of a transient response. These sensitivities are the derivatives of the eigenvalues and eigenvectors of the system. Many researchers have successfully computed modal sensitivities using several methods. Nelson's method [1] is widely used even though computationally expensive. Fox's method [2] uses a modal superposition to represent the eigenvector sensitivities by the system eigenvectors, but is inaccurate when using only a few eigenvectors. Hence, several iterative methods were proposed to increase the accuracy of Fox's method (e.g., [3] or [4]). The primary focus of the previous research was on the computational algorithms rather than the interpretation of the eigenvector sensitivities. This interpretation depends highly on the chosen normalization. An approach for incorporating these normalizations was presented by Smith [5]. This paper shows the consequence and potential use for interpretation of the chosen normalization. This is illustrated on an example using a generic two-degrees-of-freedom system, as shown in FIGURE 2.@en

Since they entered our world around the middle of the 20th century, the application of mechatronics has enhanced our lives with functionality based on the integration of electronics, control systems and electric drives. This book deals with the special class of mechatronics that has enabled the exceptional levels of accuracy and speed of high-tech equipment applied in the semiconductor industry, realising the continuous shrink in detailing of micro-electronics and MEMS. As well as the more frequently presented standard subjects of dynamics, motion control, electronics and electromechanics, this book includes an overview of systems engineering, optics and precision measurement systems, in an attempt to establish a connection between these fields under one umbrella.@en

This paper discusses a 6DoF positioning system that utilizes a thin air film to directly position flat substrates with sub-micrometer precision. Such a position system can be applied in the production of electronic devices, such as integrated circuits, flat panel displays and solar cells. All these devices are manufactured on a flat base substrate, e.g. a silicon wafer or glass plate. Precision positioning stages are used during exposure, inspection, alignment, etc. We present a planar positioning system where only the product mass is driven and without mechanical contact. This system has two main advantages: a moving mass of 2 to 3 orders of magnitude smaller, since the carrier stage is eliminated and the absence of mechanical contact reduces the chance of contamination or damage.@en