A facile method to prepare oriented boron nitride-based polymer composite with enhanced thermal conductivity and mechanical properties

Journal article (2022)

Authors

Jing Chen Chinese Academy of Sciences, Fudan University, Southern University of Science and Technology

X. Liu Electronic Components, Technology and Materials -

Xiao Liang Zeng Chinese Academy of Sciences

Huai Yu Ye Southern University of Science and Technology, Chongqing University

Kouchi Zhang Fudan University, Electronic Components, Technology and Materials -

Research Group

Electronic Components, Technology and Materials () (TU Delft)

DOI: https://doi.org/10.1016/j.coco.2021.101038

Polymer composites Thermal conductivity Mechanical property Boron nitride Vacuum-assisted self-assembly method

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Published Date

2022

Language

English

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials

Abstract

Hexagonal boron nitride (BN) is often used as filler to improve the thermal conductivity of polymer matrix due to its high thermal conductivity. However, previously reported BN-based composites always have a high in-plane thermal conductivity, which is not beneficial for vertical heat dissipation. In addition, high BN content results in the deterioration of the mechanical properties. Here, we report a feasible method to prepare a BN/silicone rubber (SiR) composite with oriented BN in organosilicon matrix via a vacuum-assisted self-assembly technique. The BN/SiR composite displays a 1270% higher (2.74 W/(m·K)) thermal conductivity than that of neat organosilicon matrix (0.20 W/(m·K)). The oriented BN nanosheets increase the polymer's adhesive force and exhibit excellent compression cycle performance. In turn, these features support its superiority as thermal interface material in the light-emitting diode chips heat dissipation application.

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