A facile method to prepare oriented boron nitride-based polymer composite with enhanced thermal conductivity and mechanical properties
Jing Chen (Fudan University, Chinese Academy of Sciences, Southern University of Science and Technology )
X. Liu (TU Delft - Electronic Components, Technology and Materials)
Xiao Liang Zeng (Chinese Academy of Sciences)
Huai Yu Ye (Chongqing University, Southern University of Science and Technology )
Guo Qi Zhang (TU Delft - Electronic Components, Technology and Materials, Fudan University)
More Info
expand_more
Other than for strictly personal use, it is not permitted to download, forward or distribute the text or part of it, without the consent of the author(s) and/or copyright holder(s), unless the work is under an open content license such as Creative Commons.
Abstract
Hexagonal boron nitride (BN) is often used as filler to improve the thermal conductivity of polymer matrix due to its high thermal conductivity. However, previously reported BN-based composites always have a high in-plane thermal conductivity, which is not beneficial for vertical heat dissipation. In addition, high BN content results in the deterioration of the mechanical properties. Here, we report a feasible method to prepare a BN/silicone rubber (SiR) composite with oriented BN in organosilicon matrix via a vacuum-assisted self-assembly technique. The BN/SiR composite displays a 1270% higher (2.74 W/(m·K)) thermal conductivity than that of neat organosilicon matrix (0.20 W/(m·K)). The oriented BN nanosheets increase the polymer's adhesive force and exhibit excellent compression cycle performance. In turn, these features support its superiority as thermal interface material in the light-emitting diode chips heat dissipation application.