Establishing Fracture Properties of EMC-Copper Interfaces in the Visco-Elastic Temperature Region
A. Xiao (TU Delft - Computational Design and Mechanics)
J de Vreugd (TU Delft - Computational Design and Mechanics)
H Pape (External organisation)
B Wunderle (External organisation)
Kaspar Jansen (TU Delft - Computational Design and Mechanics)
LJ Ernst (TU Delft - Computational Design and Mechanics)
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Abstract
An ongoing root cause of failure in microelectronic industry is interface delamination. In order to explore the risk of interface damage, FE simulations for the fabrication steps as well as for the testing conditions are generally made in the design stage.
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