Establishing Fracture Properties of EMC-Copper Interfaces in the Visco-Elastic Temperature Region

Conference paper (2009)

Authors

A. Xiao Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
J de Vreugd Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
H Pape External organisation
B Wunderle External organisation
K.M.B. Jansen Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
L.J. Ernst Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
Research Group
Computational Design and Mechanics (Mechanical, Maritime and Materials Engineering) (TU Delft)
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Published Date

2009

Language

Undefined/Unknown

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Faculty

Mechanical, Maritime and Materials Engineering

Department

Precision and Microsystems Engineering

Research Group

Computational Design and Mechanics

Abstract

An ongoing root cause of failure in microelectronic industry is interface delamination. In order to explore the risk of interface damage, FE simulations for the fabrication steps as well as for the testing conditions are generally made in the design stage.