Title
Review of Laser Sintering of Nanosilver Pastes for Die Attachment: Technologies and Trends
Author
Chen, Haixue (Fudan University)
Zhang, Jing (Heraeus Materials Technology)
Zhang, Kouchi (TU Delft Electronic Components, Technology and Materials) 
Liu, Pan (Fudan University; Research Institute of Fudan University, Ningbo)
Date
2022
Abstract
Nanosilver pastes have been regarded as the most promising die-attach materials for high-temperature and high-power applications due to their advantages such as excellent thermal conductivity, electrical conductivity, high temperature resistance, and good shear strength. However, the common hot pressing sintering process for nanosilver pastes has the limitations of long sintering time and complicated sintering processes. Thus, laser sintering has been proposed as a rapid sintering method that attracts increasing interest due to its advantages of high energy density, fast temperature rise, easy densification, etc. In this review, the recent advances in laser sintering processes were summarized, including pressure laser sintering, backside sintering, and hybrid bimodal laser sintering. The effects of various laser sintering process parameters on joint performance, such as laser power, sintering pressure, irradiation time, and defocusing amount, were further discussed. The rapid sintering mechanism of laser sintering silver nanoparticles(AgNPs) was revealed, while microscopic explanations need to be further explored. This review provided ideas and methods for subsequent researchers to develop rapid sintering methods for power electronic packaging.
Subject
Nanosilver
Laser sintering
Die Attachment
To reference this document use:
http://resolver.tudelft.nl/uuid:00c0c0b4-78e2-4c89-a351-79cba207f056
DOI
https://doi.org/10.1109/ICEPT56209.2022.9872618
Publisher
IEEE
Embargo date
2023-07-01
ISBN
978-1-6654-9906-4
Source
Proceedings of the 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
Event
2022 23rd International Conference on Electronic Packaging Technology (ICEPT), 2022-08-10 → 2022-08-13, Dalian, China
Bibliographical note
Green Open Access added to TU Delft Institutional Repository 'You share, we take care!' - Taverne project https://www.openaccess.nl/en/you-share-we-take-care Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.
Part of collection
Institutional Repository
Document type
conference paper
Rights
© 2022 Haixue Chen, Jing Zhang, Kouchi Zhang, Pan Liu