Searched for: author%3A%22Zhang%2C+Kouchi%22
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Tang, Zhuorui (author), Gu, Lin (author), Jin, Lei (author), Dai, Kefeng (author), Mao, Chaobin (author), Wu, Sanzhong (author), Zhang, Rongwei (author), Yang, Jinsong (author), Zhang, Kouchi (author)
In this work, 4H-SiC homoepitaxial layers were grown on 4°off-axis substrates at different susceptor rotation speeds by using a hot-wall horizontal CVD reactor. The effect of different susceptor rotation speed on the quality of 4H-SiC epitaxial layers in terms of thickness, thickness uniformity, crystallinity, surface morphology and...
journal article 2024
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Luo, Runding (author), Hu, D. (author), Qian, Cheng (author), Liu, Xu (author), Fan, Xuejun (author), Zhang, Kouchi (author), Fan, J. (author)
Nano-metal materials have received considerable attention because of their promising performance in wide bandgap semiconductor packaging. In this study, molecular dynamics (MD) simulation was performed to simulate the nano-Cu sintering mechanism and the subsequent mechanical behaviors. Hybrid sintering, comprising nanosphere (NS) and...
journal article 2024
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Zhang, Y. (author), Du, L. (author), Bäcke, Olof (author), Kalbfleisch, Sebastian (author), Zhang, Kouchi (author), Vollebregt, S. (author), Hörnqvist Colliander, Magnus (author)
As the dimensions of interconnects in integrated circuits continue to shrink, an urgent need arises to understand the physical mechanism associated with electromigration. Using x-ray nanodiffraction, we analyzed the stresses in Blech-structured pure Cu lines subjected to different electromigration conditions. The results suggest that the...
journal article 2024
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Liu, Minne (author), Li, Wenyu (author), Chen, Wei (author), Ibrahim, Mesfin S. (author), Xiong, Jingkang (author), Zhang, Kouchi (author), Fan, Jiajie (author)
During the operation of an LED array, its thermal and optical performances are always not equal to the superposition of the individual LED's characteristics because of a significant thermal coupling effect between the arrays. Based on this, this paper proposes an electrical–photo-thermal model, with considering both junction temperature and...
journal article 2024
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Chen, Wei (author), Liu, Xu (author), Hu, D. (author), Liu, X. (author), Zhu, Xi (author), Fan, Xuejun (author), Zhang, Kouchi (author), Fan, J. (author)
During operation in environments containing hydrogen sulfide (H<sub>2</sub>S), such as in offshore and coastal environments, sintered nanoCu in power electronics is susceptible to degradation caused by corrosion. In this study, experimental and molecular dynamics (MD) simulation analyses were conducted to investigate the evolution and...
journal article 2024
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Martin, H.A. (author), Smits, Edsger C.P. (author), Poelma, René H. (author), van Driel, W.D. (author), Zhang, Kouchi (author)
This article introduces an online condition monitoring strategy that utilizes a transient heat pulse to detect package thermal performance degradation. The metric employed is the temperature-dependent transient thermal impedance "Zth(t, Tamb)."The proposed methodology offers quantitative insights into package thermal performance degradation...
journal article 2024
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Zhou, Qiangqiang (author), Dai, Hanqing (author), Yan, Yukun (author), Qin, Zhiming (author), Zhou, Mengqi (author), Zhang, Wanlu (author), Zhang, Kouchi (author), Guo, Ruiqian (author), Wei, X. (author)
The primary challenges posed by oral mucosal diseases are their high incidence and the difficulty in managing symptoms. Inspired by the ability of bioelectricity to activate cells, accelerate metabolism, and enhance immunity, a conductive polyacrylamide/sodium alginate crosslinked hydrogel composite containing reduced graphene oxide (PAA-SA...
journal article 2024
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Hu, D. (author), Du, L. (author), Alfreider, Markus (author), Fan, J. (author), Kiener, Daniel (author), Zhang, Kouchi (author)
To fulfill the high-temperature application requirement of high-power electronics packaging, Cu nanoparticle sintering technology, with benefits in low-temperature processing and high-melting point, has attracted considerable attention as a promising candidate for the die-attach interconnect. Comprehensive mechanical characterization of the...
journal article 2024
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Wen, Minzhen (author), Ibrahim, Mesfin Seid (author), Meda, Abdulmelik Husen (author), Zhang, Kouchi (author), Fan, J. (author)
High-power white light-emitting diodes (LEDs) have demonstrated superior efficiency and reliability compared to traditional white light sources. However, ensuring maximum performance for a prolonged lifetime use presents a significant challenge for manufacturers and end users, especially in safety–critical applications. Thus, identifying...
journal article 2024
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Guo, Baotong (author), Wen, Minzhen (author), Tang, Hongyu (author), Lishik, Sergey (author), Fan, X. (author), Zhang, Kouchi (author), Fan, J. (author)
MAlSiN<sub>3</sub>:Eu<sup>2+</sup> (M = Ca, Sr) is commonly used in high-power phosphor-converted white-light-emitting diodes and laser diodes to promote their color-rendering index. However, the wide application of this phosphor is limited by the degradation of its luminescent properties in high-temperature, high-humidity, and high-sulfur...
journal article 2024
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Mo, J. (author), Schaffar, Gerald J.K. (author), Du, L. (author), Maier-Kiener, Verena (author), Kiener, Daniel (author), Vollebregt, S. (author), Zhang, Kouchi (author)
Silicon carbide (SiC) coated vertically aligned carbon nanotubes (VACNT) are attractive material for fabricating MEMS devices as an alternative for bulk micromachining of SiC. In order to examine the mechanical properties of SiC-CNT composites at high temperatures, we fabricated VACNT micro-pillars with different amounts of SiC coating and...
conference paper 2024
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Yun, Minghui (author), Yang, Daoguo (author), Cai, Miao (author), Yan, Haidong (author), Yu, Jiabing (author), Liu, Mengyuan (author), He, Siliang (author), Zhang, Kouchi (author)
Metal-oxide-semiconductor field-effect transistors (MOSFETs) undergo fatigue degradation under high thermal and electrical stresses. This process results in changes in their parasitic parameters, which can be detected using frequency domain reflectometry (FDR). Frequency domain impedance analysis is employed to characterize the various...
journal article 2024
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Mo, J. (author), Shankar, S. (author), Pezone, R. (author), Zhang, Kouchi (author), Vollebregt, S. (author)
Silicon carbide (SiC) is recognized as an excellent material for microelectromechanical systems (MEMS), especially those operating in challenging environments, such as high temperature, high radiation, and corrosive environments. However, SiC bulk micromachining is still a challenge, which hinders the development of complex SiC MEMS. To...
journal article 2024
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Chen, Wei (author), Liu, Xu (author), Yang, Zhoudong (author), Liu, X. (author), Hu, D. (author), Zhu, Xi (author), Fan, X. (author), Zhang, Kouchi (author), Fan, J. (author)
The power semiconductor joining technology through sintering of copper nanoparticles is well-suited for die attachment in wide bandgap (WBG) semiconductors, offering high electrical, thermal, and mechanical performances. However, sintered nanocopper will be prone to degradation resulting from corrosion in sulfur-containing corrosive...
journal article 2024
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Yang, Huiru (author), Huang, Qianming (author), Wang, S. (author), Zong, Qihang (author), Tan, C. (author), Ye, H. (author), Zhang, Kouchi (author)
Flexible strain sensors play a crucial role in health monitoring, smart wearable devices, and human–machine interaction. Three-dimensional surface evaluation methods for strain sensors offer advantages by being closer to actual strain, featuring a larger working range, and being more suitable for multidirectional strain. In this study, a...
journal article 2024
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Mo, J. (author), Niu, Yunfan (author), May, Alexander (author), Rommel, Mathias (author), Rossi, Chiara (author), Romijn, J. (author), Zhang, Kouchi (author), Vollebregt, S. (author)
Integrated circuits based on wide bandgap semiconductors are considered an attractive option for meeting the demand for high-temperature electronics. Here, we report an analog-to-digital converter fabricated in a silicon carbide complementary metal-oxide-semiconductor technology now available through Europractice. The MOSFET component in this...
journal article 2024
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Yang, Chenyang (author), Sun, Jianwen (author), Zhang, Yulong (author), Tang, Jingya (author), Liu, Zizheng (author), Zhan, Teng (author), Wang, Dian-Bing (author), Zhang, Kouchi (author), Liu, Zewen (author), Zhang, Xian-En (author)
The COVID-19 pandemic has highlighted the need for rapid and sensitive detection of SARS-CoV-2. Here, we report an ultrasensitive SARS-CoV-2 immunosensor by integration of an AlGaN/GaN high-electron-mobility transistor (HEMT) and anti-SARS-CoV-2 spike protein antibody. The AlGaN/GaN HEMT immunosensor has demonstrated the capability to detect...
journal article 2024
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Hu, D. (author), Wang, Chieh (author), Li, Z. (author), Gupta, N. (author), Poelma, René H. (author), Shi, Ziliang (author), Fan, J. (author), Zhang, Kouchi (author)
Driven by the increasing demand for high-power systems, ceramic substrates have received more attention for handling higher power density. Warpage in active metal brazed (AMB) ceramic substrate becomes a critical issue as it can deteriorate the reliability performance. This study comprises three phases, including investigation of the cause of...
conference paper 2024
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Li, Shizhen (author), Liu, X. (author), Gao, Chenshan (author), Wang, S. (author), Li, Jun (author), Ye, Huaiyu (author), Zhang, Kouchi (author), Wu, Shaohui (author)
The significance of wafer bonding is fundamental to the progression of electronic systems. Common fabrication techniques for Cu pillars play a crucial role in establishing resilient and efficient interconnects within semiconductor devices. It is imperative to explore the potential of nano-copper as an alternative material to overcome limitations...
conference paper 2024
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Li, Wenyu (author), Chen, Wei (author), Jiang, Jing (author), Wang, Wenbo (author), Fan, Xuejun (author), Zhang, Kouchi (author), Fan, Jiajie (author)
Thermal management has always played a significant role in power module design. Double-sided heat dissipation is more efficient at transferring heat than the traditional package. Although there are several thermal modeling approaches to power modules, the application of the numerical models, which are computationally fast and accurate, has...
conference paper 2024
Searched for: author%3A%22Zhang%2C+Kouchi%22
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