Title
Multi-parameters optimization for electromigration in WLCSP solder bumps
Author
Du, L. (TU Delft Electronic Components, Technology and Materials)
Deng, Shanliang (TU Delft Electronic Components, Technology and Materials) 
Cui, Z. (TU Delft Electronic Components, Technology and Materials)
Poelma, René H. (TU Delft Electronic Components, Technology and Materials; Nexperia)
Beelen-Hendrikx, Caroline (Nexperia)
Zhang, Kouchi (TU Delft Electronic Components, Technology and Materials)
Date
2024
Abstract
In this study, we combined finite element method (FEM) based on Ansys and Noesis Optimus software to investigate the effect of bump structures and loading conditions on the electromigration properties of solder bumps in WLCSP. A numerical model considering current density, vacancy concentration, stress and temperature was utilized to calculate the vacancy concentration in solder bumps. The Optimus is an optimization software which can be used to perform the design of experiment (DOE) and sensitivity analysis. To optimize the bump structure, the DOE and response surface modeling (RSM) analysis were performed by using Noesis Optimus. The design optimization based on Noesis Optimus has three main advantages. First, the sensitivity analysis based on DOE results helps to find the most contributing factors. Second, it saves huge time because hundreds of experiments can be executed automatically. Third, it is able to perform evolutionary design optimization directly on RSM to identify the design’s optimal performance point. The maximum and concentration around solder were selected as the index to evaluate the effect of parameter combination on electromigration properties.
Subject
Temperature sensors
Electromigration
Temperature
Sensitivity analysis
Loading
Software
Numerical models
To reference this document use:
http://resolver.tudelft.nl/uuid:457f4cb0-9452-4380-b634-d1d50f1718e4
DOI
https://doi.org/10.1109/EuroSimE60745.2024.10491411
Publisher
IEEE
Embargo date
2024-10-09
ISBN
979-8-3503-9364-4
Source
Proceedings of the 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Event
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024-04-07 → 2024-04-10, Catania, Italy
Series
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024
Bibliographical note
Green Open Access added to TU Delft Institutional Repository 'You share, we take care!' - Taverne project https://www.openaccess.nl/en/you-share-we-take-care Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.
Part of collection
Institutional Repository
Document type
conference paper
Rights
© 2024 L. Du, Shanliang Deng, Z. Cui, René H. Poelma, Caroline Beelen-Hendrikx, Kouchi Zhang