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Wang, Xinyue (author), Yang, Zhoudong (author), Zhang, Kouchi (author), Zhang, Jing (author), Liu, Pan (author)With the popularization of wide band-gap power modules in offshore wind power systems and water surface photovoltaic power stations, packaging materials face challenges of corrosion by salt, blended with high humidity. Copper-silver (Cu-Ag) composite sintered paste was proposed by researchers as a novel die-attach material for a lower cost...conference paper 2023
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Zhang, Y. (author), Mo, J. (author), Cui, Z. (author), Vollebregt, S. (author), Zhang, Kouchi (author)The continuous downscaling of microelectronics has introduced many reliability issues on interconnect. Electromigration and dewetting are major reliability concerns in high-temperature micro- and nanoscale devices. In this paper, the local dewetting of copper thin film during the electromigration test was first found and investigated. When...conference paper 2023
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Thukral, V. (author), Bacquet, Irene (author), Van Soestbergen, Michiel (author), Zaal, Jeroen (author), Roucou, Romuald (author), Rongen, Rene (author), van Driel, W.D. (author), Zhang, Kouchi (author)Board level vibration testing is a commonly used method to predict the solder joint reliability of surface-mounted components seated onto printed circuit boards (PCB). Current board level vibration test methods are mainly developed from a solely mechanical stress application standpoint. This makes such stress tests one dimensional in nature...conference paper 2023
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Sattari, R. (author), Hu, D. (author), Liu, X. (author), van Zeijl, H.W. (author), Vollebregt, S. (author), Zhang, Kouchi (author)The rapid development of power electronics has challenged the thermal integrity of semiconductor packaging. Further developments in this domain can be supported significantly by utilizing fast and flexible thermal characteristic evaluation. This study employs the transient dual interface method (TDIM) to characterize and compare the thermal...journal article 2023
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van Ginkel, H.J. (author), Mitterhuber, Lisa (author), van de Putte, Marijn Willem (author), Huijben, Mark (author), Vollebregt, S. (author), Zhang, Kouchi (author)Reducing the thermal conductivity of thermoelectric materials has been a field of intense research to improve the efficiency of thermoelectric devices. One approach is to create a nanostructured thermoelectric material that has a low thermal conductivity due to its high number of grain boundaries or voids, which scatter phonons. Here, we present...journal article 2023
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Nyns, Emile C.A. (author), Portero, Vincent (author), Deng, Shanliang (author), Jin, T. (author), Harlaar, Niels (author), Bart, Cindy I. (author), van Brakel, Thomas J. (author), Palmen, Meindert (author), Hjortnaes, Jesper (author), Ramkisoensing, Arti A. (author), Zhang, Kouchi (author), Poelma, René H. (author), Ördög, Balázs (author), de Vries, Antoine A.F. (author), Pijnappels, Daniël A. (author)Background: Optogenetics could offer a solution to the current lack of an ambulatory method for the rapid automated cardioversion of atrial fibrillation (AF), but key translational aspects remain to be studied. Objective: To investigate whether optogenetic cardioversion of AF is effective in the aged heart and whether sufficient light...journal article 2023
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Liu, Ke (author), Tan, C. (author), Li, Shizhen (author), Yuan, Wucheng (author), Liu, X. (author), Zhang, Kouchi (author), French, P.J. (author), Ye, H. (author), Wang, S. (author)This paper proposes and simulates research on the reverse recovery characteristics of two novel superjunction (SJ) MOSFETs by adjusting the doping profile. In the manufacturing process of the SJ MOSFET using multilayer epitaxial deposition (MED), the position and concentration of each Boron bubble can be adjusted by designing different doping...journal article 2023
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Yang, Huiru (author), Wang, S. (author), Huang, Qianming (author), Tan, C. (author), Gao, Chenshan (author), Xu, Siyuan (author), Ye, Huaiyu (author), Zhang, Kouchi (author)Flexible strain sensors based on nanomaterials have sparked a lot of interest in the field of wearable smart electronics. Laser induced graphene (LIG) based sensors in particular stand out due to their straightforward fabrication procedure, three-dimensional porous structures, and exceptional electromechanical capabilities. Recent studies...journal article 2023
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Hu, D. (author), Qian, Cheng (author), Liu, X. (author), Du, L. (author), Sun, Zhongchao (author), Fan, X. (author), Zhang, Kouchi (author), Fan, J. (author)As a promising technology for high-power and high-temperature power electronics packaging, nanocopper (nanoCu) paste sintering has recently received increasing attention as a die-attachment. The high-temperature deformation of sintered nanoCu paste and its underlying mechanisms challenge the reliability of high-power electronics packaging. In...journal article 2023
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Huang, Qian Ming (author), Yang, Huiru (author), Wang, S. (author), Liu, X. (author), Tan, C. (author), Luo, Anxin (author), Xu, Siyuan (author), Zhang, Kouchi (author), Ye, H. (author)Laser-induced graphene (LIG) has aroused a wide range of research interests ranging from micro-nano energy devices to the Internet of Things (IoT). Nevertheless, the non-degradability of most-used synthetic polymer carbon sources poses a serious threat to the environment. In this work, ecofriendly chitosan-based derivatives, including...journal article 2023
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Rapid Fabrication of High-Performance Flexible Pressure Sensors Using Laser Pyrolysis Direct WritingWang, S. (author), Zong, Qihang (author), Yang, Huiru (author), Tan, C. (author), Huang, Qianming (author), Liu, X. (author), Zhang, Kouchi (author), French, P.J. (author), Ye, H. (author)The fabrication of flexible pressure sensors with low cost, high scalability, and easy fabrication is an essential driving force in developing flexible electronics, especially for high-performance sensors that require precise surface microstructures. However, optimizing complex fabrication processes and expensive microfabrication methods...journal article 2023
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Wang, Xinyue (author), Yang, Zhoudong (author), Wang, Boya (author), Chen, Wei (author), Zhang, Kouchi (author), Zhang, Jing (author), Fan, J. (author), Liu, P. (author)Power modules applied in offshore applications are facing risks of corrosion failures on die-attach materials due to high humidity and H<sub>2</sub>S exposure. To investigate such corrosion behavior for sintered die-attach materials, we conducted a study with four groups of samples fabricated using copper and silver metal particles under...journal article 2023
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Chen, Haixue (author), Wang, Xinyue (author), Zeng, Zejun (author), Zhang, Kouchi (author), Zhang, Jing (author), Liu, Pan (author)With the development of electronic technology towards high power, miniaturization, and system integration, power electronic packaging is facing increasing challenges, especially for die attachment. This research aims to explore silver-coated copper (Cu@Ag) paste with sufficient mechanical properties and high-temperature reliability, as an...journal article 2023
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Copper Nanoparticle Sintering Enabled Hermetic Packaging With Fine Sealing Ring for MEMS ApplicationHu, D. (author), Shah, M.B. (author), Fan, J. (author), Vollebregt, S. (author), Zhang, Kouchi (author)Driving by the increased demand for hermetic packaging in the more than Moore (MtM) roadmap, a Cu nanoparticle sintering-enabled hermetic sealing solution was developed with a small-size sealing ring. The developed technology simplifies microfabrication and requires less surface roughness using a sinterable Cu nanoparticle paste. A 50μm size...journal article 2023
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Ji, X. (author), Du, L. (author), He, S. (author), van Zeijl, H.W. (author), Zhang, Kouchi (author)Copper nanoparticles (CuNPs) sintering for flip-chip interconnects is a promising solution for 3D and heterogeneous integration to overcome the limitation of solder materials. To this end, we perform the photolithographic stencil printing method to pattern CuNPs, and the form of flip-chip interconnects is completed after CuNPs sintering...journal article 2023
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Inamdar, A.S. (author), van Driel, W.D. (author), Zhang, Kouchi (author)Digital Twin can be broadly described as a continuously updated virtual representation of an object, system, or process which replicates all phases in the lifecycle of its physical counterpart. Originally conceptualized in 2003 [1], the term `Digital Twin' came into existence after it first appeared in NASA's roadmap in 2010 [2]. The concept...conference paper 2023
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Dai, Hanqing (author), Dai, Wenqing (author), Chen, Yuanyuan (author), Yan, Yukun (author), Zuo, Guangzheng (author), Hu, Zhe (author), Wei, Jinxin (author), Zhou, Wenjie (author), Zhang, Kouchi (author)Sulfide minerals hold significant importance in both fundamental science and industrial advancement. However, certain natural sulfide minerals, such as NaFe<sub>3</sub>S<sub>5</sub>·2H<sub>2</sub>O (NFS), pose great challenges for exploitation and synthesis due to their high susceptibility to oxidation. To date, no successful precedent exists...journal article 2023
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Tan, C. (author), Wang, S. (author), Yang, Huiru (author), Huang, Qianming (author), Li, Shizhen (author), Liu, X. (author), Ye, H. (author), Zhang, Kouchi (author)Short-wave ultraviolet (also called UVC) irradiation is a well-adopted method of viral inactivation due to its ability to damage genetic material. A fundamental problem with the UVC inactivation method is that its mechanism of action on viruses is still unknown at the molecular level. To address this problem, herein we investigate the...journal article 2023
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Dai, Hanqing (author), Dai, Wenqing (author), Zhang, Wanlu (author), Zhang, Kouchi (author), Guo, Ruiqian (author)The natural design and coupling of biological structures are the root of realizing the high strength, toughness, and unique functional properties of biomaterials. Advanced architecture design is applied to many materials, including metal materials, inorganic nonmetallic materials, polymer materials, and so on. To improve the performance of...review 2023
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Sattari, R. (author), van Zeijl, H.W. (author), Zhang, Kouchi (author)This study presents the design and fabrication of an in-package relative humidity sensor for epoxy molding compound (EMC) packages. The sensor comprises shielded interdigital electrodes (SIDE) for in-situ monitoring of humidity absorption/desorption in the package encapsulation layer. A novel approach is employed in the device fabrication to...conference paper 2023