Manufacturing of an In-Package Relative Humidity Sensor for Epoxy Molding Compound Packages

Manufacturing of an In-Package Relative Humidity Sensor for Epoxy Molding Compound Packages

Sattari, R. (TU Delft Electronic Components, Technology and Materials)
van Zeijl, H.W. (TU Delft Electronic Components, Technology and Materials)
Zhang, Kouchi (TU Delft Electronic Components, Technology and Materials)

2023

This study presents the design and fabrication of an in-package relative humidity sensor for epoxy molding compound (EMC) packages. The sensor comprises shielded interdigital electrodes (SIDE) for in-situ monitoring of humidity absorption/desorption in the package encapsulation layer. A novel approach is employed in the device fabrication to maximize the electrical field lines to pass through the EMC and enhance the sensitivity. The manufactured wafer includes 6×6mm2 dies, each containing six identical capacitive sensors with an area of 480 × 620 μ m2. SU-8 through polymer vias (TPVs) with high aspect ratio were created to locally mold the sensors by EMC. The linear capacitance change with the relative humidity level is simulated in COMSOL Multiphysics. Three designs were compared, and the calibration results show the capacitance value of 1.54 pF and 5.85 pF before and after molding, respectively. The capacitance value stays within the range of 5.85 to 5.86 pF with less than 7 aF variation under different biasing voltages, indicating the stability and robustness of the capacitance.

Electromagnetic compatibility
In-package relative humidity sensor
epoxy molding compound
shielded interdigital electrodes
encapsulation layer
electrical field lines
through polymer vias

http://resolver.tudelft.nl/uuid:4c536315-7881-47cb-92b2-d9c19e9f0a51

https://doi.org/10.1109/EuroSimE56861.2023.10100771

IEEE

2023-10-17

979-8-3503-4598-8

Proceedings of the 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023-04-16 → 2023-04-19, Graz, Austria

2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023

Green Open Access added to TU Delft Institutional Repository 'You share, we take care!' - Taverne project https://www.openaccess.nl/en/you-share-we-take-care Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.

Institutional Repository

conference paper

© 2023 R. Sattari, H.W. van Zeijl, Kouchi Zhang