Evaluating the safety and efficiency impacts of forced lane change with negative gaps based on empirical vehicle trajectories

A lane-changing (LC) maneuver may cause the follower in the target lane (new follower) to decelerate and give up space, potentially affecting crash risk and traffic flow efficiency. In congested flow, a more aggressive LC maneuver occurs where the lane changer is partially next to the new follower and creates negative gaps, namely negative...

Microstructure evolution and micromechanical behavior of solvent-modified Cu–Ag composite sintered joints for power electronics packaging at high temperatures

With the increased deployment of power modules in demanding conditions, sintering materials, especially composite sintering materials, have raised growing interest due to their cost-effectiveness and suitability. Therefore, this study explores the viability of Cu–Ag composite sintering material, focusing on solvent influence through...

Integrating the flow regime and water quality effects into a niche-based metacommunity dynamics model for river ecosystems

Aquatic community dynamics are closely dominated by flow regime and water quality conditions, which are increasingly threatened by dam regulation, water diversion, and nutrition pollution. However, further understanding of the ecological impacts of flow regime and water quality conditions on aquatic multi-population dynamics has rarely been...

How Gaps are Created during Anticipation of Lane Changes

The pre-insertion process called anticipation is an essential component of a lane-changing manoeuvre. There is little empirical research regarding the impact of anticipation. Thus, this paper aims to explore the behaviour of the new follower (NF) in the target lane when it encounters anticipation by using new trajectory datasets. The changing...

Polymer Reinforced Solder Paste for Improving Impact Energy Absorption Capability in Micro LED Laser-Assisted Mass Transfer

Micro LED displays offer superior performance compared to traditional LCD and OLED displays. However, challenges in transfer technology, such as high throughput and scalability, must be addressed. Among various mass transfer techniques, stamp transfer and laser-assisted transfer are widely used for Micro LED assembly. The laser-assisted transfer...

Simulation, Prediction, and Verification of the Corrosion Behavior of Cu-Ag Composite Sintered Paste for Power Semiconductor Die-attach Applications

With the popularization of wide band-gap power modules in offshore wind power systems and water surface photovoltaic power stations, packaging materials face challenges of corrosion by salt, blended with high humidity. Copper-silver (Cu-Ag) composite sintered paste was proposed by researchers as a novel die-attach material for a lower cost...

Solvent modulation, microstructure evaluation, process optimization, and nanoindentation analysis of micro-Cu@Ag core–shell sintering paste for power electronics packaging

With the development of electronic technology towards high power, miniaturization, and system integration, power electronic packaging is facing increasing challenges, especially for die attachment. This research aims to explore silver-coated copper (Cu@Ag) paste with sufficient mechanical properties and high-temperature reliability, as an...

Modeling the impact of lane-changing's anticipation on car-following behavior

Lane-changing (LC) in congested traffic has been identified as a trigger for the sudden deceleration behavior of the new follower in the target lane, leading to severe traffic disturbances. Thus, investigating the response of the new follower to an LC maneuver is an important research topic in the literature. To date, numerous efforts have...

Finite element modeling and analysis of ultrasonic bonding process of thick aluminum wires for power electronic packaging

Ultrasonic wedge bonding of aluminum (Al) wires is a widely applied interconnect technology for power electronic packaging. The joint quality of the wedge bonding is mainly affected by the process parameters and material properties. Inappropriate process parameters will lead to failure modes such as chip surface pit, metal layer peeling off,...

A new reinforcement learning-based variable speed limit control approach to improve traffic efficiency against freeway jam waves

Conventional reinforcement learning (RL) models of variable speed limit (VSL) control systems (and traffic control systems in general) cannot be trained in real traffic process because new control actions are usually explored randomly, which may result in high costs (delays) due to exploration and learning. For this reason, existing RL-based...

Review of Laser Sintering of Nanosilver Pastes for Die Attachment: Technologies and Trends

Nanosilver pastes have been regarded as the most promising die-attach materials for high-temperature and high-power applications due to their advantages such as excellent thermal conductivity, electrical conductivity, high temperature resistance, and good shear strength. However, the common hot pressing sintering process for nanosilver pastes...

Finite Element Analysis of Power Module Packages with One-step Molding for Power Inductors

With the development of 5G communication technology and the rise of power semiconductors, the switching frequency of the circuit keeps increasing, which pushes for miniaturization of power modules and related components. Therefore, in this paper, a one-step molding technology was proposed for a DC/DC buck converter power module. We proposed a...

An Alternative Micro LED Mass Transfer Technology: Self-Assembly

Micro LED display technology has been spotlighted as the most promising technology compared to LCD and OLED. Its excellent advantages include higher brightness, self-illumination, higher resolution, lower power consumption, faster response, higher integration, higher stability, thinner thickness, longer life, etc. In terms of the unique benefits...

Finite Element Modeling for Thermal Conductivity of Cement-based Encapsulation Materials

With the trend of miniaturization and the increasing power density, the operating temperature of electronic devices keeps climbing, especially for wide band-gap semiconductors such as silicon carbide and gallium nitride. The high operating temperature up to 250℃ brings challenges to encapsulation materials since traditional encapsulation...

Joint Analysis and Reliability Test of Epoxy-Based Nano Silver Paste Under Different Pressure-Less Sintering Processes

Recent years, the sintered silver paste was introduced and further developed for power electronics packaging due to low processing temperature and high working temperature. The pressure-less sintering technology reduces the stress damage caused by the pressure to the chip, improves reliability, and is widely applied in manufacturing....

Simulation and Verification or Cu@Ag Core-shell Sintered Paste for Power Semiconductor Die-attach Applications

With the increasing application of wide bandgap materials such as silicon carbide and gallium nitride in power devices, the working temperature of power devices has been pushed further. Therefore, it brings higher requirements for packaging materials. Sintered silver is a widely accepted chip connection material. However, silver suffers from...

Wafer Scale Flexible Interconnect Transfer for Hetrogeneous Integration

A polymer-based wafer level integration technology suitable for miniaturized and multi-functional systems integration was developed and demonstrated in this work. Wafer scale flexible interconnects were firstly fabricated on one wafer, and then transferred to another wafer. Such transfer process involved wafer bonding and application of...