System in package (SiP) technology

System in package (SiP) technology: Fundamentals, design and applications

Santagata, F. (Guangdong Dongguan Quality Supervision Testing Center)
Sun, J. (TU Delft Electronic Components, Technology and Materials)
Iervolino, E. (Southern University of Science and Technology)
Yu, H. (Southern University of Science and Technology)
Wang, F. (Southern University of Science and Technology)
Zhang, Kouchi (TU Delft Electronic Components, Technology and Materials)
Sarro, Pasqualina M (TU Delft Electronic Components, Technology and Materials)
Zhang, Guoyi

2018

Purpose: The purpose of this paper is to demonstrate a novel 3D system-in-package (SiP) approach. This new packaging approach is based on stacked silicon submount technology. As demonstrators, a smart lighting module and a sensor systems were successfully developed by using the fabrication and assembly process described in this paper. Design/methodology/approach: The stacked module consists of multiple layers of silicon submounts which can be designed and fabricated in parallel. The 3D stacking design offers higher silicon efficiency and miniaturized package form factor. This platform consists of silicon submount design and fabrication, module packaging, system assembling and testing and analyzing. Findings: In this paper, a smart light emitting diode system and sensor system will be described based on stacked silicon submount and 3D SiP technology. The integrated smart lighting module meets the optical requirements of general lighting applications. The developed SiP design is also implemented into the miniaturization of particular matter sensors and gas sensor detection system. Originality/value: SiP has great potential of integrating multiple components into a single compact package, which has potential implementation in intelligent applications.

Gas sensor system
LED module
PM sensor
System-in-package (SiP)

http://resolver.tudelft.nl/uuid:065e62f5-8841-438e-9060-037352e04085

https://doi.org/10.1108/MI-09-2017-0045

2021-11-29

1356-5362

Microelectronics International: an international journal, 35 (4), 231-243

Green Open Access added to TU Delft Institutional Repository ‘You share, we take care!’ – Taverne project https://www.openaccess.nl/en/you-share-we-take-care Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.

Institutional Repository

journal article

© 2018 F. Santagata, J. Sun, E. Iervolino, H. Yu, F. Wang, Kouchi Zhang, Pasqualina M Sarro, Guoyi Zhang