Temperature Field Simulation and optimization for Horizontal 6-inch 4H-SiC Epitaxial CVD Reactor by Induction Heating

Temperature Field Simulation and optimization for Horizontal 6-inch 4H-SiC Epitaxial CVD Reactor by Induction Heating

Tang, Zhuorui (Fudan University; Jihua Laboratory)
Tian, Jing (Fudan University)
Mao, Chaobin (Jihua Laboratory)
Zhang, Nan (Jihua Laboratory)
Huang, Jiyu (Jihua Laboratory)
Fan, J. (TU Delft Electronic Components, Technology and Materials; Fudan University; Research Institute of Fudan University, Ningbo)
Zhang, Kouchi (TU Delft Electronic Components, Technology and Materials)

2023

Silicon carbide (SiC) epitaxial process is a key step in the fabrication of power devices, and the temperature field inside the reactor chamber plays an essential role in this process. In this paper, the temperature field in the horizontal chemical-vapor-deposition reactor chamber used for growing homo-epitaxial 4H-SiC material is studied using the finite-element method. A three-dimensional time-dependency model is built for the accuracy of simulation, and the effects of 11 relative coil locations (−50, −28, −18, −10, −4,0,4,10,18,28, and 50 mm) on heating efficiency and temperature uniformity of the substrate are analyzed. Results indicate that the suitable relative location between the center of coil and that of the substrate to achieve optimum temperature uniformity is −4 mm, and 18 mm to obtain the highest heating efficiency. To increase the heating efficiency and temperature uniformity of the substrate, the structure of the reactor was analyzed and optimized. It is observed that both heating efficiency and temperature uniformity can be effectively improved by adding a graphite pillar inside the down susceptor.

http://resolver.tudelft.nl/uuid:0a1ae4ac-11e8-4e29-ab51-294eb0cecfee

https://doi.org/10.1109/EuroSimE56861.2023.10100813

IEEE

2023-10-17

979-8-3503-4598-8

Proceedings of the 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023-04-16 → 2023-04-19, Graz, Austria

Green Open Access added to TU Delft Institutional Repository 'You share, we take care!' - Taverne project https://www.openaccess.nl/en/you-share-we-take-care Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.

Institutional Repository

conference paper

© 2023 Zhuorui Tang, Jing Tian, Chaobin Mao, Nan Zhang, Jiyu Huang, J. Fan, Kouchi Zhang