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Chen, Wei (author), Liu, Xu (author), Hu, D. (author), Liu, X. (author), Zhu, Xi (author), Fan, Xuejun (author), Zhang, Kouchi (author), Fan, J. (author)During operation in environments containing hydrogen sulfide (H<sub>2</sub>S), such as in offshore and coastal environments, sintered nanoCu in power electronics is susceptible to degradation caused by corrosion. In this study, experimental and molecular dynamics (MD) simulation analyses were conducted to investigate the evolution and...journal article 2024
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Tang, Hongyu (author), Shi, Weiqi (author), Zhang, Rongjun (author), Fan, J. (author), Zhang, Kouchi (author)Tungsten disulfide (WS2) has recently attracted considerable attention owing to its excellent physical, chemical, electronic, and optical properties, leading to increased research into its applications in electronic and optoelectronic devices. However, the oxidation of 2D material affects significantly its optical and electronic properties...conference paper 2024
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Chen, Wei (author), Liu, Xu (author), Yang, Zhoudong (author), Liu, X. (author), Hu, D. (author), Zhu, Xi (author), Fan, X. (author), Zhang, Kouchi (author), Fan, J. (author)The power semiconductor joining technology through sintering of copper nanoparticles is well-suited for die attachment in wide bandgap (WBG) semiconductors, offering high electrical, thermal, and mechanical performances. However, sintered nanocopper will be prone to degradation resulting from corrosion in sulfur-containing corrosive...journal article 2024
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Liu, Xu (author), Hu, D. (author), Li, Z. (author), Fan, Xuejun (author), Zhang, Kouchi (author), Fan, J. (author)The nano-copper particles are widely used in the sintering processes of packaging wide bandgap semiconductors. Despite the significant success in the industry, the mechanism bridging the sintering process to the mechanical properties of sintered nano-copper is not yet well-modeled. In this paper, the impacts of different sintering temperatures...conference paper 2024
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Hu, D. (author), Wang, Chieh (author), Li, Z. (author), Gupta, N. (author), Poelma, René H. (author), Shi, Ziliang (author), Fan, J. (author), Zhang, Kouchi (author)Driven by the increasing demand for high-power systems, ceramic substrates have received more attention for handling higher power density. Warpage in active metal brazed (AMB) ceramic substrate becomes a critical issue as it can deteriorate the reliability performance. This study comprises three phases, including investigation of the cause of...conference paper 2024
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Hu, D. (author), Du, L. (author), Alfreider, Markus (author), Fan, J. (author), Kiener, Daniel (author), Zhang, Kouchi (author)To fulfill the high-temperature application requirement of high-power electronics packaging, Cu nanoparticle sintering technology, with benefits in low-temperature processing and high-melting point, has attracted considerable attention as a promising candidate for the die-attach interconnect. Comprehensive mechanical characterization of the...journal article 2024
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Guo, Baotong (author), Wen, Minzhen (author), Tang, Hongyu (author), Lishik, Sergey (author), Fan, X. (author), Zhang, Kouchi (author), Fan, J. (author)MAlSiN<sub>3</sub>:Eu<sup>2+</sup> (M = Ca, Sr) is commonly used in high-power phosphor-converted white-light-emitting diodes and laser diodes to promote their color-rendering index. However, the wide application of this phosphor is limited by the degradation of its luminescent properties in high-temperature, high-humidity, and high-sulfur...journal article 2024
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Wen, Minzhen (author), Ibrahim, Mesfin Seid (author), Meda, Abdulmelik Husen (author), Zhang, Kouchi (author), Fan, J. (author)High-power white light-emitting diodes (LEDs) have demonstrated superior efficiency and reliability compared to traditional white light sources. However, ensuring maximum performance for a prolonged lifetime use presents a significant challenge for manufacturers and end users, especially in safety–critical applications. Thus, identifying...journal article 2024
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Tang, Zhuorui (author), Zhao, Shibo (author), Li, Jian (author), Zuo, Yuanhui (author), Tian, Jing (author), Tang, Hongyu (author), Fan, J. (author), Zhang, Kouchi (author)This work addresses a novel technique for selecting the best process parameters for the 4H–SiC epitaxial layer in a horizontal hot-wall chemical vapor reactor using a transient multi-physical (thermal-fluid-chemical) simulation model and combined with a machine-learning model. An experiment was performed to validate the feasibility of the...journal article 2024
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Luo, Runding (author), Hu, D. (author), Qian, Cheng (author), Liu, Xu (author), Fan, Xuejun (author), Zhang, Kouchi (author), Fan, J. (author)Nano-metal materials have received considerable attention because of their promising performance in wide bandgap semiconductor packaging. In this study, molecular dynamics (MD) simulation was performed to simulate the nano-Cu sintering mechanism and the subsequent mechanical behaviors. Hybrid sintering, comprising nanosphere (NS) and...journal article 2024
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Chen, Wei (author), Yan, Xuyang (author), Ibrahim, Mesfin S. (author), Meda, Abdulmelik H. (author), Fan, X. (author), Zhang, Kouchi (author), Fan, J. (author)As the next generation of semiconductor devices, SiC MOSFETs have demonstrated significant performance improvements in switching loss, switching frequency, and high-temperature operation compared to Si-based MOSFETs. However, the long-term reliability of such devices and their packaging continues to be a major concern. Towards addressing this...conference paper 2023
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Cui, Z. (author), Fan, X. (author), Zhang, Y. (author), Vollebregt, S. (author), Fan, J. (author), Zhang, Kouchi (author)This paper presented integrated electromigration (EM) studies through experiment, theory, and simulation. First, extensive EM tests were performed using Blech and standard wafer-level electromigration acceleration test (SWEAT)-like structures, which were fabricated on four-inch wafers. Second, a molecular dynamics (MD) simulation-based...journal article 2023
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Cui, Z. (author), Fan, X. (author), Zhang, Y. (author), Vollebregt, S. (author), Fan, J. (author), Zhang, Kouchi (author)This paper presented a comprehensive experimental and simulation study for thermomigration (TM) accompanying electromigration (EM) at elevated current densities. Both Blech and standard wafer-level electromigration acceleration test (SWEAT)-like test structures, with aluminum (Al) as a carrier, were used for testing and analysis. In Part I of...journal article 2023
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Hu, D. (author), Li, Z. (author), Fan, J. (author), Zhang, Kouchi (author)As a critical part of speeding up industrial electrification, power electronics, and its packaging technology are undergoing rapid development. Cu nanoparticle sintering technology has therefore received extensive attention for its excellent performance in the die-attachment layer, where the mechanical properties are essential to be known for...conference paper 2023
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Hu, D. (author), Qian, Cheng (author), Liu, X. (author), Du, L. (author), Sun, Zhongchao (author), Fan, X. (author), Zhang, Kouchi (author), Fan, J. (author)As a promising technology for high-power and high-temperature power electronics packaging, nanocopper (nanoCu) paste sintering has recently received increasing attention as a die-attachment. The high-temperature deformation of sintered nanoCu paste and its underlying mechanisms challenge the reliability of high-power electronics packaging. In...journal article 2023
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Wang, Xinyue (author), Yang, Zhoudong (author), Wang, Boya (author), Chen, Wei (author), Zhang, Kouchi (author), Zhang, Jing (author), Fan, J. (author), Liu, P. (author)Power modules applied in offshore applications are facing risks of corrosion failures on die-attach materials due to high humidity and H<sub>2</sub>S exposure. To investigate such corrosion behavior for sintered die-attach materials, we conducted a study with four groups of samples fabricated using copper and silver metal particles under...journal article 2023
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Copper Nanoparticle Sintering Enabled Hermetic Packaging With Fine Sealing Ring for MEMS ApplicationHu, D. (author), Shah, M.B. (author), Fan, J. (author), Vollebregt, S. (author), Zhang, Kouchi (author)Driving by the increased demand for hermetic packaging in the more than Moore (MtM) roadmap, a Cu nanoparticle sintering-enabled hermetic sealing solution was developed with a small-size sealing ring. The developed technology simplifies microfabrication and requires less surface roughness using a sinterable Cu nanoparticle paste. A 50μm size...journal article 2023
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Wen, Minzhen (author), Guo, Baotong (author), Chen, Shanghuan (author), Hu, X. (author), Fan, Xuejun (author), Zhang, Kouchi (author), Fan, J. (author)The (Ca, Sr) AlSiN₃:Eu²⁺(CSASN:Eu) red phosphor is widely used to improve color rendering of high-power phosphor-converted lighting diode (pc-WLED), but it is always unstable under high temperature and high humidity environments. Therefore, the studies on the temperature and humidity resistance of red phosphors and their aging mechanism have...conference paper 2023
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Liu, Minne (author), Ibrahim, Mesfin S. (author), Wen, Minzhen (author), Li, Sheng (author), Wang, An (author), Zhang, Kouchi (author), Fan, J. (author)Spectral power distribution (SPD) is the radiation power intensity at different wavelengths, containing the most basic photometric and colorimetric performance of the illuminant, which is able to predict the lifetime of LEDs. This paper proposes an SPD model assisted by machine learning algorithms to detect the early failure of white LEDs. The...conference paper 2023
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Qian, Cheng (author), Hu, D. (author), Liu, Xu (author), Fan, Xuejun (author), Zhang, Kouchi (author), Fan, J. (author)Nano-metal materials sintering has received increasing attention in recent years for its promising performance in the wide bandgap semiconductor packaging. In this paper, molecular dynamics (MD) simulation method were applied to simulate the nano-Cu sintering mechanism and the subsequent mechanical behavior. Hybrid sintering, comprising...conference paper 2023