Title
Design, Fabrication, and Characterization of a 4H-SiC CMOS Readout Circuit for Monolithic Integration with SiC Sensors
Author
Sattari, R. (TU Delft Electronic Components, Technology and Materials)
van Zeijl, H.W. (TU Delft Electronic Components, Technology and Materials)
Zhang, Kouchi (TU Delft Electronic Components, Technology and Materials) 
Date
2023
Abstract
This paper reports the design and fabrication of a 4H-SiC CMOS readout circuit enabling monolithic integration of silicon carbide (SiC) sensors and circuits. Compared to conventional Si electronics, 4H-SiC integrated circuits can sustain operation in harsh conditions such as higher temperatures and radiation levels. The proposed amplifier performance is well balanced through the temperature range of 25 °C to 400 °C. Compared to state-of-the-art, the proposed SiC readout circuit does not include any off-chip components. The amplifier is fully differential, and hence shows improved common-mode rejection and signal-to-noise ratio (SNR). It can be monolithically integrated with SiC sensors in a scalable SiC technology.
Subject
ability
SiC technology
monolithic integration
readout circuit
off-chip component
fully differential
common-mode rejection
signal-to-noise ratio (SNR)
To reference this document use:
http://resolver.tudelft.nl/uuid:136f6979-1a19-463f-bb34-5a87060f3eed
DOI
https://doi.org/10.23919/EMPC55870.2023.10418435
Publisher
IEEE
Embargo date
2024-08-09
ISBN
978-1-6654-8736-8
Source
Proceedings of the 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)
Event
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC), 2023-09-11 → 2023-09-14, Cambridge, United Kingdom
Series
24th European Microelectronics and Packaging Conference, EMPC 2023
Bibliographical note
Green Open Access added to TU Delft Institutional Repository 'You share, we take care!' - Taverne project https://www.openaccess.nl/en/you-share-we-take-care Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.
Part of collection
Institutional Repository
Document type
conference paper
Rights
© 2023 R. Sattari, H.W. van Zeijl, Kouchi Zhang