Print Email Facebook Twitter Systematic approach for tolerance analysis of photonic systems Title Systematic approach for tolerance analysis of photonic systems Author Van Gurp, J.F.C. Tichem, M. Staufer, U. Faculty Mechanical, Maritime and Materials Engineering Department Precision and Microsystems Engineering Date 2011-05-16 Abstract Passive alignment of photonic components is an assembly method compatible with a high production volume. Its precision performance relies completely on the dimensional accuracies of geometrical alignment features. A tolerance analysis plays a key role in designing and optimizing these passive alignment features. The objective of this paper is to develop a systematic approach for conducting such tolerance analysis, starting with a conceptual package design, setting up the tolerance chain, describing it mathematically and converting the misalignment to a coupling loss probability distribution expressed in dB. The method has successfully been applied to a case study where an indium phosphide (InP) chip is aligned with a TriPleX1 (SiO2 cladding with Si3N4 core) interposer via a silicon optical bench (SiOB). Subject tolerance analysis, tolerance chain, photonics, passive alignment, optical coupling, micro assembly To reference this document use: http://resolver.tudelft.nl/uuid:179c6b6b-33c6-48ac-ab04-320b26fdb6dd DOI https://doi.org/10.1117/12.902756 Publisher SPIE ISSN 0277-786X Source https://doi.org/10.1117/12.902756 Source Proceedings of SPIE, 2011 vol. 8007 Part of collection Institutional Repository Document type conference paper Rights (c)2011 Van Gurp, J.F.C., Tichem, M., Staufer, U. Files PDF 2011-8007.Gurp.pdf 438.07 KB Close viewer /islandora/object/uuid:179c6b6b-33c6-48ac-ab04-320b26fdb6dd/datastream/OBJ/view