Title
Degradation of silicone-based sealing materials used in microelectronics
Author
Yazdan Mehr, M. (TU Delft Electronic Components, Technology and Materials) 
Hajipour, Pejman (University of Alberta)
van Zeijl, H.W. (TU Delft Electronic Components, Technology and Materials)
van Driel, W.D. (TU Delft Electronic Components, Technology and Materials; Signify)
Cooremans, Thierry (Dow Silicones)
De Buyl, Francois (Dow Silicones)
Zhang, Kouchi (TU Delft Electronic Components, Technology and Materials)
Date
2023
Abstract
Adhesive bonding is a key joining technology in many industrial applications, including automotive, aerospace industries, biomedical devices, and microelectronic components. Adhesive bonding is gaining more and more attention due to the increasing demand for joining similar or dissimilar components, mostly within the framework of designing lightweight structures. Silicone sealant is widely used in engineering application due to its thermal stability, excellent energy absorption, and good damping characteristics. In those applications, sealant usually exposed to various environment stress, such as, high temperature, mechanical stress, humidity, light radiation, and chemical attack. Long-term stability and durability of sealant is crucial to the performance of the associated application. The main degrading factors for silicone in microelectronic applications are temperature, humidity, alkali, and mechanical loading. The focus in the present paper is to understand different failure mechanisms in silicone sealants and adhesives and to study how different environmental, mechanical, and service-related stresses attribute to the kinetics and extent of degradation in silicone sealants and adhesives. The impact of different failure mechanisms on the lifetime and reliability of microelectronic devices will be methodically investigated.
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http://resolver.tudelft.nl/uuid:475b63e5-c303-4817-b382-fc8b9d2a925c
DOI
https://doi.org/10.1109/EuroSimE56861.2023.10100796
Publisher
IEEE
Embargo date
2023-10-17
ISBN
979-8-3503-4598-8
Source
Proceedings of the 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Event
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023-04-16 → 2023-04-19, Graz, Austria
Series
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023
Bibliographical note
Green Open Access added to TU Delft Institutional Repository 'You share, we take care!' - Taverne project https://www.openaccess.nl/en/you-share-we-take-care Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.
Part of collection
Institutional Repository
Document type
conference paper
Rights
© 2023 M. Yazdan Mehr, Pejman Hajipour, H.W. van Zeijl, W.D. van Driel, Thierry Cooremans, Francois De Buyl, Kouchi Zhang