A Thin-film Reconfigurable SiC Thermal Test Chip for Reliability Monitoring in Harsh Environments

A Thin-film Reconfigurable SiC Thermal Test Chip for Reliability Monitoring in Harsh Environments

Sattari, R. (TU Delft Electronic Components, Technology and Materials)
van Zeijl, H.W. (TU Delft Electronic Components, Technology and Materials)
Zhang, Kouchi (TU Delft Electronic Components, Technology and Materials)

2023

Wide bandgap (WBG) semiconductor technologies enable significant progress in the emergence of power modules. Power cycling at elevated temperatures causes crack or delamination failure, especially at the die-attached bonded interface in the long term. Therefore, the in-situ reliability investigation of power modules, materials, and semiconductor packages is of great significance for modern industries. The silicon carbide's higher bandgap energy, intrinsic thermal conductivity, and mechanical strength make it a great candidate for the next generation of semiconductor, designed to operate in harsh conditions. In this study, a thin-film reconfigurable silicon carbide (SiC) thermal test chip (TTC) is designed and fabricated for reliability assessment in harsh environments. The proposed TTC realizes in-situ power/thermal cycling tests at elevated temperatures as well as characterization of novel materials such as nanoparticle-based sintering materials in die-attach technology and high-temperature-compatible epoxy molding compounds. The chip is equipped with thin-film platinum microheaters to realize modular power mappings, and platinum resistive temperature detectors (RTD) to examine the thermal reliability by monitoring the precise changes of the internal junction-to-case thermal resistance.

bandgap energy
die-attach
in-situ reliability investigation
junction-to-case thermal resistance
nanoparticle-based sintering
power cycling
power modules
resistive temperature detectors
thermal conductivity
Wide bandgap semiconductor technology

http://resolver.tudelft.nl/uuid:a124953d-7e22-41af-9e72-e4c7f08ae9ff

https://doi.org/10.1109/ECTC51909.2023.00223

IEEE

2024-02-03

979-8-3503-3499-9

Proceedings of the 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

73rd IEEE Electronic Components and Technology Conference, ECTC 2023, 2023-05-30 → 2023-06-02, Orlando, United States

Proceedings - Electronic Components and Technology Conference, 0569-5503, 2023-May

Green Open Access added to TU Delft Institutional Repository 'You share, we take care!' - Taverne project https://www.openaccess.nl/en/you-share-we-take-care Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.

Institutional Repository

conference paper

© 2023 R. Sattari, H.W. van Zeijl, Kouchi Zhang