Print Email Facebook Twitter Micromechanical modeling of stress evolution induced during cure in a particle-filled electronic packaging polymer Title Micromechanical modeling of stress evolution induced during cure in a particle-filled electronic packaging polymer Author Jansen, K.M.B. Wang, L.G. Ernst, L.J. Zhang, G.Q. Bressers, H.J.L. Faculty Mechanical, Maritime and Materials Engineering Date 2004 To reference this document use: http://resolver.tudelft.nl/uuid:e5616d30-459c-4b71-a1f0-909093986b95 Publisher IEEE ISSN 1521-3331 Source IEEE Transactions on Components and Packaging Technologies,27 (4) [see also IEEE Transactions on Components, Packaging and Manufacturing Technology, Part A: Packaging Technologies] Part of collection Institutional Repository Document type journal article Rights (c) 2004 Daoguo Yang; Jansen, K.M.B.; Wang, L.G.; Ernst, L.J.; Zhang, G.Q.; Bressers, H.J.L.; Xuejun Fan Files PDF ieee_daoguoyang_2004.pdf 1.31 MB Close viewer /islandora/object/uuid:e5616d30-459c-4b71-a1f0-909093986b95/datastream/OBJ/view