A Thin and Low-Inductance 1200 V SiC MOSFET Fan-Out Panel-Level Packaging With Thermal Cycling Reliability Evaluation

SiC MOSFET is mainly characterized by the higher electric breakdown field, higher thermal conductivity, and lower switching loss enabling high breakdown voltage, high-temperature operation, and high switching frequency. However, their performances are considerably limited by the high parasitic inductance and poor heat dissipation capabilities...

Damage evolution in a self-healing air plasma sprayed thermal barrier coating containing self-shielding MoSi ₂ particles

A self‐healing thermal barrier coating (TBC) system is manufactured by air plasma spraying (APS) and tested by thermal cycling. The ceramic topcoat in the self‐healing APS TBC system consists of an yttria stabilised zirconia (YSZ) matrix and contains self‐shielding aluminium containing MoSi2 healing particles dispersed close to the topcoat/bond...