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Online Condition Monitoring Methodology for Power Electronics Package Reliability Assessment
Multi-parameters optimization for electromigration in WLCSP solder bumps
Copper Nanoparticle Sintering Enabled Hermetic Packaging With Fine Sealing Ring for MEMS Application
A Highly Linear Temperature Sensor Operating up to 600°C in a 4H-SiC CMOS Technology
In Situ Failure Detection of Electronic Control Units Using Piezoresistive Stress Sensor
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