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Multi-parameters optimization for electromigration in WLCSP solder bumps
Warpage deformation analysis of AMB ceramic substrates in power modules
Sintering Process Simulation of Ag Nanoparticles by Phase Field Method
Heterogeneous Integration of Diamond Heat Spreaders for Power Electronics Application
High-temperature creep properties of a novel solder material and its thermal fatigue properties under potting material
Microstructure Analysis Based on 3D reconstruction Model and Transient Thermal Impedance Measurement of Resin-reinforced Sintered Ag layer for High power RF device
Investigation of Potting Compounds on Thermal-Fatigue properties of Solder Interconnects
Designing a 100 [aF/nm] capacitive transducer
Wafer Level Through Polymer Optical Vias (TPOV) Enabling High Throughput of Optical Windows Manufacturing
Non-linear bulk micromachined accelerometer for high sensitivity applications
High aspect ratio spiral resonators for process variation investigation and MEMS applications
3D interconnect technology based on low temperature copper nanoparticle sintering
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