AI4SmallFarms: A Dataset for Crop Field Delineation in Southeast Asian Smallholder Farms

Thermal-mechanical-electrical Co-design of Fan-Out Panel-Level SiC MOSFET Packaging with a Multi-objective Optimization Algorithm

A Hybrid Magnetic Current Sensor With a Multiplexed Ripple-Reduction Loop

Low-cost acoustic force trap in a microfluidic channel

Coupling model of electromigration and experimental verification – Part I: Effect of atomic concentration gradient

Coupling model of electromigration and experimental verification – Part II: Impact of thermomigration

Emergent collective organization of bone cells in complex curvature fields

Extrinsic self-healing asphalt materials: A mini review

Effect of Passivation and Mechanical Constraint on Electromigration in Interconnect

A Class-D Piezoelectric Speaker Driver Using A Quadrature Feedback Chopping Scheme achieving 29dB Large-Signal THD+N Improvement

Nanoindentation characterization of sintered porous Cu nanoparticles used in power electronics packaging – A molecular dynamic simulation study

A 155W −95.6 dB THD+N GaN-based Class-D Audio Amplifier With LC Filter Nonlinearity Compensation

Railway ballast performance: Recent advances in the understanding of geometry, distribution and degradation

Design knowledge graph-aided conceptual product design approach based on joint entity and relation extraction

Three-dimensional localization microscopy with increased axial precision through TIRF angle modulation

High temperature viscoplastic deformation behavior of sintered nanocopper paste used in power electronics packaging: Insights from constitutive and multi-scale modelling

Effect of epoxy resin addition on properties and corrosion behavior of sintered joints in power modules serviced offshore

A Hybrid Magnetic Current Sensor With a Dual Differential DC Servo Loop

New Techniques and Methods for Modelling, Visualization, and Analysis of a 3D City

Copper Nanoparticle Sintering Enabled Hermetic Packaging With Fine Sealing Ring for MEMS Application