- Investigating the Sintering Process and Mechanical Properties of Nano-copper Particles Coupling Particle Packing Modeling with Molecular Dynamics Simulation
- Nanoindentation characterization of sintered porous Cu nanoparticles used in power electronics packaging – A molecular dynamic simulation study
- Hydrolysis Mechanism Analysis of (Ca, Sr)AlSiN₃:Eu²⁺ Red Phosphor Aged Under Pressure Cooker Test and 85°C&85%RH Test: Kinetics Modeling and First-principles Calculation
- Microstructure Analysis Based on 3D reconstruction Model and Transient Thermal Impedance Measurement of Resin-reinforced Sintered Ag layer for High power RF device
- Study on Sintering Mechanism and Mechanical Properties of Nano-Cu based on Molecular Dynamics Simulation