Junction temperature and luminous flux prediction for white LED array based on electrical-photo-thermal modeling

Unraveling the hydrogen sulfide aging mechanism on electrical-thermal–mechanical property degradation of sintered nanocopper interconnects used in power electronics packaging

Insights into sulfur and hydrogen sulfide induced corrosion of sintered nanocopper paste: A combined experimental and ab initio study

Microscopic fracture toughness of notched porous sintered Cu micro-cantilevers for power electronics packaging

Naturally effective inhibition of microbial corrosion on carbon steel by beneficial biofilm in the South China Sea

Revealing The Degradation Mechanism of (Sr,Ca)AlSiN₃:Eu²⁺ Phosphor Aged Under Thermal-Moisture-Sulfur Conditions: A Combined Experimental and Ab Initio Study

In-Situ early anomaly detection and remaining useful lifetime prediction for high-power white LEDs with distance and entropy-based long short-term memory recurrent neural networks

Optimal Design of 100–2000 V 4H–SiC Power MOSFETs using Multi-objective Particle Swarm Optimization Algorithms

Optimizing the chemical vapor deposition process of 4H–SiC epitaxial layer growth with machine-learning-assisted multiphysics simulations

Molecular dynamics simulations on mechanical behaviors of sintered nanocopper in power electronics packaging

Microstructure evolution and micromechanical behavior of solvent-modified Cu–Ag composite sintered joints for power electronics packaging at high temperatures

Coupling model of electromigration and experimental verification – Part I: Effect of atomic concentration gradient

Coupling model of electromigration and experimental verification – Part II: Impact of thermomigration

High temperature viscoplastic deformation behavior of sintered nanocopper paste used in power electronics packaging: Insights from constitutive and multi-scale modelling

Effect of epoxy resin addition on properties and corrosion behavior of sintered joints in power modules serviced offshore

Copper Nanoparticle Sintering Enabled Hermetic Packaging With Fine Sealing Ring for MEMS Application

A 120.9-dB DR Digital-Input Capacitively Coupled Chopper Class-D Audio Amplifier

Research on the optimal dosage of bio-oil/lignin composite modified asphalt based on rheological and anti-aging properties

Assessment of Vigilance Level during Work: Fitting a Hidden Markov Model to Heart Rate Variability

A Thin and Low-Inductance 1200 V SiC MOSFET Fan-Out Panel-Level Packaging With Thermal Cycling Reliability Evaluation