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Karmakar, S. (author), Zhang, H. (author), Berkhout, Marco (author), Fan, Q. (author)
This paper presents a Class-D piezoelectric speaker driver that employs a quadrature feedback chopping scheme (QCS). Compared to a conventional single feedback chopping scheme (SCS), the use of QCS can eliminate the timing skew between low-voltage (LV) and high-voltage (HV) choppers, greatly improving large-signal linearity. A prototype...
conference paper 2023
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Xun, H. (author), Fieback, M. (author), Yuan, S. (author), Zhang, Ziwei (author), Taouil, M. (author), Hamdioui, S. (author)
Resistive Random Access Memory (RRAM) is a potential technology to replace conventional memories by providing low power consumption and high-density storage. As various manufacturing vendors make significant efforts to push it to high-volume production and commercialization, high-quality and efficient test solutions are of great importance. This...
conference paper 2023
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Zhang, Haoming (author), Wang, Zhanxin (author), Vallery, H. (author)
The global navigation satellite systems (GNSS) play a vital role in transport systems for accurate and consistent vehicle localization. However, GNSS observations can be distorted due to multipath effects and non-line-of-sight (NLOS) receptions in challenging environments such as urban canyons. In such cases, traditional methods to classify...
conference paper 2023
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Zhang, Y. (author), Mo, J. (author), Vollebregt, S. (author), Zhang, Kouchi (author), May, Alexander (author), Erlbacher, Tobias (author)
The 4H-silicon carbide (SiC) exhibits excellent material characteristics, particularly in high-temperature, high-power, high-frequency applications. However, the reliability of SiC-based devices operating in harsh environments is a critical concern. While time-dependent dielectric breakdown (TDDB) in conventional SiC devices has been extensively...
conference paper 2023
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Yuan, S. (author), Zhang, Z. (author), Fieback, M. (author), Xun, H. (author), Marinissen, E. J. (author), Kar, G. S. (author), Rao, S. (author), Couet, S. (author), Taouil, M. (author), Hamdioui, S. (author)
The development of Spin-Transfer Torque Magnetic RAMs (STT-MRAMs) mass production requires high-quality test solutions. Accurate and appropriate fault modeling is crucial for the realization of such solutions. This paper targets fault modeling and test generation for all interconnect and contact defects in STT-MRAMs and shows that using the...
conference paper 2023
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Sattari, R. (author), van Zeijl, H.W. (author), Zhang, Kouchi (author)
This paper reports the design and fabrication of a 4H-SiC CMOS readout circuit enabling monolithic integration of silicon carbide (SiC) sensors and circuits. Compared to conventional Si electronics, 4H-SiC integrated circuits can sustain operation in harsh conditions such as higher temperatures and radiation levels. The proposed amplifier...
conference paper 2023
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Hu, D. (author), Li, Z. (author), Fan, J. (author), Zhang, Kouchi (author)
As a critical part of speeding up industrial electrification, power electronics, and its packaging technology are undergoing rapid development. Cu nanoparticle sintering technology has therefore received extensive attention for its excellent performance in the die-attachment layer, where the mechanical properties are essential to be known for...
conference paper 2023
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Sattari, R. (author), van Zeijl, H.W. (author), Zhang, Kouchi (author)
This study presents a novel manufacturing process and design towards an enhanced sensitivity of an in-package relative humidity sensor. The device comprises multi-width interdigital electrodes which make oxide pillars appear during wet chemical etching in the fabrication process. Those oxide pillars appear only in wider areas while completely...
conference paper 2023
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Martin, H.A. (author), Reintjes, Marcia (author), Reijs, Dave (author), Dorrestein, Sander (author), Kengen, Martien (author), Libon, Sebastien (author), Smits, Edsger (author), Tang, Xiao (author), Koelink, Marco (author), Poelma, René H. (author), van Driel, W.D. (author), Zhang, Kouchi (author)
Integrated Circuits and Electronic Modules experience concentrated thermal hot spots, which require advanced thermal solutions for effective distribution and dissipation of heat. The superior thermal properties of diamonds are long known, and it is an ideal material for heat-spreading applications. However, growing diamond films to the...
conference paper 2023
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Ji, Liangzheng (author), Li, Zaihuan (author), Zhang, Kouchi (author), Zhang, Jing (author), Liu, Pan (author)
Micro LED displays offer superior performance compared to traditional LCD and OLED displays. However, challenges in transfer technology, such as high throughput and scalability, must be addressed. Among various mass transfer techniques, stamp transfer and laser-assisted transfer are widely used for Micro LED assembly. The laser-assisted transfer...
conference paper 2023
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Zhang, X. (author), Hassan HosseinNia, S. (author)
Reset control systems have possessed the potential to meet the demands of machines, such as faster response times, improved disturbance rejection and enhanced tracking performance. However, prior research on the analysis and design of reset controllers has been restricted to the assumption of two resets per period, neglecting multiple-reset...
conference paper 2023
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Qu, Yiting (author), He, Xinlei (author), Pierson, Shannon (author), Backes, Michael (author), Zhang, Y. (author), Zannettou, S. (author)
The dissemination of hateful memes online has adverse effects on social media platforms and the real world. Detecting hateful memes is challenging, one of the reasons being the evolutionary nature of memes; new hateful memes can emerge by fusing hateful connotations with other cultural ideas or symbols. In this paper, we propose a framework that...
conference paper 2023
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Yu, Haoyuan (author), Zhang, Hanwen (author), Wang, Yanbo (author), Qin, Z. (author), Chen, Zhe (author), Bauer, P. (author)
This article investigates the stability of triple active bridge (TAB) converter with different types of loads. In this paper, port2 of TAB converter adopts voltage control to supply a constant power load (CPL), and port3 uses voltage control to supply a resistor or uses current control to supply a battery. Then, an extra element theorem-based ...
conference paper 2023
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Du, L. (author), Zhao, Xiujuan (author), Poelma, René H. (author), van Driel, W.D. (author), Zhang, Kouchi (author)
SnBiAgCu solder alloy is an attractive soldering material for temperature-sensitive electronic devices due to its excellent creep properties. This study firstly reports the creep properties of SnBiAgCu solder alloy under different temperatures. Results show that the addition of Bi resulted in better creep resistance compared with that of...
conference paper 2023
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Wang, Xinyue (author), Yang, Zhoudong (author), Zhang, Kouchi (author), Zhang, Jing (author), Liu, Pan (author)
With the popularization of wide band-gap power modules in offshore wind power systems and water surface photovoltaic power stations, packaging materials face challenges of corrosion by salt, blended with high humidity. Copper-silver (Cu-Ag) composite sintered paste was proposed by researchers as a novel die-attach material for a lower cost...
conference paper 2023
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Zhang, Y. (author), Mo, J. (author), Cui, Z. (author), Vollebregt, S. (author), Zhang, Kouchi (author)
The continuous downscaling of microelectronics has introduced many reliability issues on interconnect. Electromigration and dewetting are major reliability concerns in high-temperature micro- and nanoscale devices. In this paper, the local dewetting of copper thin film during the electromigration test was first found and investigated. When...
conference paper 2023
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Thukral, V. (author), Bacquet, Irene (author), Van Soestbergen, Michiel (author), Zaal, Jeroen (author), Roucou, Romuald (author), Rongen, Rene (author), van Driel, W.D. (author), Zhang, Kouchi (author)
Board level vibration testing is a commonly used method to predict the solder joint reliability of surface-mounted components seated onto printed circuit boards (PCB). Current board level vibration test methods are mainly developed from a solely mechanical stress application standpoint. This makes such stress tests one dimensional in nature...
conference paper 2023
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Chen, Minggang (author), Zhang, H. (author), Fan, Q. (author)
Silicon MOSFETs-based medium-power (< 50W) Class-D amplifiers (CDAs) switching in the MHz range have gained popularity in recent years, which achieves better linearity thanks to a higher loop gain in the audio band while enabling the use of LC filters with higher cut-off frequencies. However, for high-power (>100 W) CDAs, such switching...
conference paper 2023
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Zhang, Y. (author), Herygers, Aaricia (author), Patel, T.B. (author), Yue, Z. (author), Scharenborg, O.E. (author)
Automatic speech recognition (ASR) should serve every speaker, not only the majority “standard” speakers of a language. In order to build inclusive ASR, mitigating the bias against speaker groups who speak in a “non-standard” or “diverse” way is crucial. We aim to mitigate the bias against non-native-accented Flemish in a Flemish ASR system....
conference paper 2023
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Balim, Haldun (author), Park, Seonwook (author), Wang, Xi (author), Zhang, X. (author), Hilliges, Otmar (author)
Despite the recent development of learning-based gaze estimation methods, most methods require one or more eye or face region crops as inputs and produce a gaze direction vector as output. Cropping results in a higher resolution in the eye regions and having fewer confounding factors (such as clothing and hair) is believed to benefit the final...
conference paper 2023
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