Pressure-assisted CU sintering for SiC Die-attachment application

High-temperature nanoindentation characterization of sintered nano-copper particles used in high power electronics packaging

Nano-copper sintering is one of new die-attachment and interconnection solutions to realize the wide bandgap semiconductor power electronics packaging with benefits on high temperature, low inductance, low thermal resistance and low cost. Aiming to assess the high-temperature reliability of sintered nano-copper die-attachment and...

Influence of SiO₂, TiO₂ and Fe₂O₃ nanoparticles on the properties of fly ash blended cement mortars

This study explores the effects of different types of nanoparticles, namely nano-SiO₂ (NS), nano-TiO₂ (NT), and nano-Fe₂O₃ (NF) on the fresh properties, mechanical properties, and microstructure of cement mortar containing fly ash as a supplementary cementitious material. These nanoparticles existed...