From Si Towards SiC Technology for Harsh Environment Sensing

In the coming decade, the development in the area of More than Moore will certainly take over from Moore’s Law. Sensor development and sensor integration will prevail above lower node development. New packaging solutions will be developed which will fuel the integration of sensors. These developments can still be silicon based but where harsh...

High-resolution MEMS inertial sensor combining large-displacement buckling behaviour with integrated capacitive readout

Commercially available gravimeters and seismometers can be used for measuring Earth’s acceleration at resolution levels in the order of ng∕Hz (where g represents earth’s gravity) but they are typically high-cost and bulky. In this work the design of a bulk micromachined MEMS device exploiting non-linear buckling behaviour is described, aiming...

Designing a 100 [aF/nm] capacitive transducer

The mechanical part of inertial sensors can be designed to have a large mechanical sensitivity, but also requires the transduction mechanism which translates this displacement. The overall system resolution in mechanical inertial sensors is dictated by the noise contribution of each stage and the magnitude of each sensitivity, see also Figure...