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Li, Shizhen (author), Liu, X. (author), Gao, Chenshan (author), Wang, S. (author), Li, Jun (author), Ye, Huaiyu (author), Zhang, Kouchi (author), Wu, Shaohui (author)
The significance of wafer bonding is fundamental to the progression of electronic systems. Common fabrication techniques for Cu pillars play a crucial role in establishing resilient and efficient interconnects within semiconductor devices. It is imperative to explore the potential of nano-copper as an alternative material to overcome limitations...
conference paper 2024
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Wang, S. (author), Yang, Huiru (author), Zong, Qihang (author), Huang, Qianming (author), Tan, C. (author), Gao, Chenshan (author), Li, Shizhen (author), Ye, H. (author), Zhang, Kouchi (author), French, P.J. (author)
In recent years, metal crack-based stretchable flexible strain sensors have attracted significant attention in wearable device applications due to their extremely high sensitivity. However, the tradeoff between sensitivity and detection range has been an intractable dilemma, severely limiting their practical applications. Herein, we propose a...
journal article 2023
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Liu, X. (author), Li, Shizhen (author), Tan, C. (author), Gao, Chenshan (author), Liu, Yang (author), Ye, H. (author), Zhang, Kouchi (author)
Nano copper sintering technology has great potential to be widely applied in the wide-bandgap semiconductor packaging. In order to investigate the coalescence kinetics of copper nano particles for this application, a molecular dynamic (MD) simulation was carried out at low temperature on a special model containing two substrate and multiple...
journal article 2022
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Li, Shizhen (author), Liu, X. (author), Jiang, Jing (author), Tan, C. (author), Gao, Chenshan (author), Liu, Yang (author), Ye, H. (author), Zhang, Kouchi (author)
Cu-Ag core-shell (CS) nanoparticle (NP) is considered as a cost-effective alternative material to nano silver sintering material in die attachment application. To further reduce the cost, the thickness of the Ag shell can be adjusted. Whereas the shell thickness will also affect the thermal stability of the Cu-Ag CSNPs. In this study, molecular...
conference paper 2022
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Yang, Huiru (author), Li, Junfeng (author), Shao, Ziyuan (author), Tan, C. (author), Gao, Chenshan (author), Cui, Hongyuan (author), Tang, Xiaosheng (author), Liu, Yufei (author), Zhang, Kouchi (author), Ye, H. (author)
The development of high-performance gas sensing materials is one of the development trends of new gas sensor technology. In this work, in order to predict the gas-sensitive characteristics of HfSe<sub>2</sub> and its potential as a gas-sensitive material, the interactions of nonmetallic element (O, S, Te) doped HfSe<sub>2</sub> monolayer and...
journal article 2022
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