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Li, Shizhen (author), Liu, X. (author), Gao, Chenshan (author), Wang, S. (author), Li, Jun (author), Ye, Huaiyu (author), Zhang, Kouchi (author), Wu, Shaohui (author)The significance of wafer bonding is fundamental to the progression of electronic systems. Common fabrication techniques for Cu pillars play a crucial role in establishing resilient and efficient interconnects within semiconductor devices. It is imperative to explore the potential of nano-copper as an alternative material to overcome limitations...conference paper 2024
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Liu, Xu (author), Hu, D. (author), Li, Z. (author), Fan, Xuejun (author), Zhang, Kouchi (author), Fan, J. (author)The nano-copper particles are widely used in the sintering processes of packaging wide bandgap semiconductors. Despite the significant success in the industry, the mechanism bridging the sintering process to the mechanical properties of sintered nano-copper is not yet well-modeled. In this paper, the impacts of different sintering temperatures...conference paper 2024
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Liu, Q. (author), Ghodrat, Dr. Sepideh (author), Jansen, K.M.B. (author)We developed a shape-changing constructive kit, named Mimosa1. A key component of the toolkit is the modular hinges, each of which is equipped with two antagonistic shape memory alloy (SMA) wires. One wire deforms the hinge to approach its predetermined angle at high temperature, and another wire drives the hinge back when it cools down....conference paper 2024
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Lin, P. (author), Liu, X. (author), Ren, S. (author), Li, Yi (author), Erkens, S. (author), Welvaarts, B. (author), Brouns, K. (author)Developed by Delft University of Technology, the tri-component polyurethane modified cold binder (PMCB) displays impressive durability and strength in asphalt mixtures, showing promise as a reliable binder for cold in-place recycling. However, when applying PMCB for rapid, in-situ recycling, the presence of moisture in reclaimed asphalt...conference paper 2024
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Rattay, Sonja (author), Collins, Robert (author), Surana, Aditi (author), Lee, Youngsil (author), Liu, Y. (author), Mauri, Andrea (author), Urquhart, Lachlan D (author), Vines, John (author), Wilson, Cara (author), Pschetz, Larissa (author), Rozendaal, M.C. (author), Shklovski, Irina (author)Sensor networks are increasingly commonplace in visions of smart cities and future healthcare systems, promising greater efficiency and increased wellbeing. However, the design of these technologies remains focused on specific users and fragmented by context, overlooking the diversity of needs, wants and values present when technologies, people,...conference paper 2023
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Jing, R. (author), Apostolidis, P. (author), Liu, X. (author), Naus, R. (author), Erkens, S. (author), Scarpas, Athanasios (author)Epoxy asphalt attracted the attention of road authorities in many countries as a solution for du-rable open-graded porous asphalt (OGPA) surface layers with enhanced longevity. Nevertheless, the recycla-bility of aged epoxy asphalt materials has not been thoroughly studied yet. This research presents an experi-mental program conducted in the...conference paper 2023
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Su, D. (author), Liu, Jian (author)Nowadays, city clusters have become an important spatial form in the process of global urbanization, characterized by contiguous development across provincial, municipal, and county administrative boundaries, given all-around cross-border circulation of socio-economic factors at the regional scale has become the trend. In order to pursue their...conference paper 2023
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Feng, Z. (author), Ferrari, Riccardo M.G. (author), van Wingerden, J.W. (author), Liu, Y. (author)Wind turbines may experience local weather perturbation, which is not taken into account by the commonly-used wind turbine simulation packages. Without this information, it is extremely challenging to evaluate the controller performance with regard to the effect of the variation of local atmospheric conditions. On the other side, it is too...conference paper 2023
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Liu, L. (author), Xie, F. (author), Popov, M. (author), Hao, Zhiguo (author), Lekić, A. (author)This article presents an accurate DC fault location method that applies parameter fitting. This technique first discusses the traveling wave (TW) propagation process in the decoupled line-mode network. We obtain the exact fault distance equation based on the analytical expressions for the wavefront of backward line-mode voltage TW. The adaptive...conference paper 2023
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Xie, F. (author), Liu, L. (author), Hao, Zhiguo (author), Lekić, A. (author), Popov, M. (author)Existing line protection methods for multi-terminal direct current (MTDC) systems are constrained by the placement and values of boundary elements. To overcome this limitation, this paper proposes a non-unit DC line protection method based on the normalized backward traveling waves (BTWs) of the 1-mode voltage. Firstly, this article studies...conference paper 2023
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Liu, Minne (author), Ibrahim, Mesfin S. (author), Wen, Minzhen (author), Li, Sheng (author), Wang, An (author), Zhang, Kouchi (author), Fan, J. (author)Spectral power distribution (SPD) is the radiation power intensity at different wavelengths, containing the most basic photometric and colorimetric performance of the illuminant, which is able to predict the lifetime of LEDs. This paper proposes an SPD model assisted by machine learning algorithms to detect the early failure of white LEDs. The...conference paper 2023
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Liu, C. (author), van Kampen, E. (author), de Croon, G.C.H.E. (author)Enabling the capability of assessing risk and making risk-aware decisions is essential to applying reinforcement learning to safety-critical robots like drones. In this paper, we investigate a specific case where a nano quadcopter robot learns to navigate an apriori-unknown cluttered environment under partial observability. We present a...conference paper 2023
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Qian, Cheng (author), Hu, D. (author), Liu, Xu (author), Fan, Xuejun (author), Zhang, Kouchi (author), Fan, J. (author)Nano-metal materials sintering has received increasing attention in recent years for its promising performance in the wide bandgap semiconductor packaging. In this paper, molecular dynamics (MD) simulation method were applied to simulate the nano-Cu sintering mechanism and the subsequent mechanical behavior. Hybrid sintering, comprising...conference paper 2023
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Li, Shizhen (author), Jiang, Jing (author), Liu, X. (author), Wang, S. (author), Zhang, Zhonghua (author), Ye, Huaiyu (author)Substrate metallization is a crucial factor affecting the mechanical properties of sintered nanoparticles in microelectronics applications, as it is essential for ensuring good adhesion between the substrate and the sintered material. In this study, we investigated the influence of metallization on pressure-assisted nanocopper sintering and...conference paper 2023
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Wang, S. (author), Tan, Yanlong (author), Liu, Xu (author), Li, Shizhen (author), Liu, Ke (author), Yuan, Wucheng (author), Li, Tao (author), Zhang, Kouchi (author), French, P.J. (author), Ye, Huaiyu (author), Tan, Chunjian (author)In this article, the avalanche withstand capability and transient failure model of commercial 1200 V asymmetric trench gate SiC MOSFETs are investigated by experiment and simulation under single-pulse unclamped inductive switching (UIS) conditions. The limiting avalanche current and limiting avalanche energy of the device are determined by...conference paper 2023
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Luopan, Yaxin (author), Han, Rui (author), Zhang, Qinglong (author), Liu, Chi Harold (author), Wang, Guoren (author), Chen, Lydia Y. (author)Deep Neural Networks (DNNs) have been ubiquitously adopted in internet of things and are becoming an integral of our daily life. When tackling the evolving learning tasks in real world, such as classifying different types of objects, DNNs face the challenge to continually retrain themselves according to the tasks on different edge devices....conference paper 2023
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Zhang, Qinglong (author), Han, Rui (author), Liu, Chi Harold (author), Wang, Guoren (author), Chen, Lydia Y. (author)Vision applications powered by deep neural networks (DNNs) are widely deployed on edge devices and solve the learning tasks of incoming data streams whose class label and input feature continuously evolve, known as domain shift. Despite its prominent presence in real-world edge scenarios, existing benchmarks used by domain adaptation methods...conference paper 2023
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Liu, Bin (author), Wang, Q. (author), Pollin, Sofie (author)This paper presents a novel transparent amplifying intelligent surface (TAIS) architecture for uplink enhancement in indoor-to-outdoor mmWave communications. The TAIS is an amplifier-based transmissive intelligent surface that can refract and amplify the incident signal, instead of only refracting it with adjustable phase shift by most passive...conference paper 2023
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Xue, Chaozhong (author), Dong, Y. (author), Liu, Jiaqi (author), Liao, Yijun (author), Li, Lingbo (author)Medical waste recycling and treatment has gradually drawn concerns from the whole society, as the amount of medical waste generated is increasing dramatically, especially during the pandemic of COVID-19. To tackle the emerging challenges, this study designs a reverse logistics system architecture with three modules, i.e., medical waste...conference paper 2023