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Du, L. (author), Zhao, Xiujuan (author), Watte, Piet (author), Poelma, René H. (author), van Driel, W.D. (author), Zhang, Kouchi (author)
The objective of this article is to investigate the thermal-fatigue properties of a commercially available lead-free solder alloy (SnBiAgCu) under the use of different types of potting compounds. Solder alloys with lower silver content are expected to substitute the conventional solder alloys SAC305 (Sn-3.0Ag-0.5Cu). First, the tensile...
conference paper 2022
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Feng, Shuo (author), Jiang, Tao (author), Chen, Wei (author), Fan, Xuejun (author), Zhang, Kouchi (author), Fan, Jiajie (author)
As a core packaging material of light color conversion, phosphor/silicone composite plays an indispensable role in light emitting diode (LED) packaging. At present, commercial LED packages mainly use blue LED chips to stimulate Yttrium Aluminum Garnet (YAG) yellow phosphor to reach a white color. However, (Ca,Sr)AlSiN 3 :Eu 2+ (CSASN) red...
conference paper 2022
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Chen, Haixue (author), Zhang, Jing (author), Zhang, Kouchi (author), Liu, Pan (author)
Nanosilver pastes have been regarded as the most promising die-attach materials for high-temperature and high-power applications due to their advantages such as excellent thermal conductivity, electrical conductivity, high temperature resistance, and good shear strength. However, the common hot pressing sintering process for nanosilver pastes...
conference paper 2022
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Li, Shizhen (author), Liu, X. (author), Jiang, Jing (author), Tan, C. (author), Gao, Chenshan (author), Liu, Yang (author), Ye, H. (author), Zhang, Kouchi (author)
Cu-Ag core-shell (CS) nanoparticle (NP) is considered as a cost-effective alternative material to nano silver sintering material in die attachment application. To further reduce the cost, the thickness of the Ag shell can be adjusted. Whereas the shell thickness will also affect the thermal stability of the Cu-Ag CSNPs. In this study, molecular...
conference paper 2022
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Li, Xiao (author), Tang, Jiuyang (author), Zhao, Jiayan (author), Li, Jinbing (author), Zhang, Kouchi (author), Liu, Pan (author)
With the development of 5G communication technology and the rise of power semiconductors, the switching frequency of the circuit keeps increasing, which pushes for miniaturization of power modules and related components. Therefore, in this paper, a one-step molding technology was proposed for a DC/DC buck converter power module. We proposed a...
conference paper 2022
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Band, Ruben (author), Lips, Maarten (author), Prawira, Julivius (author), van Schagen, Jurgen (author), Tulling, Simon (author), Zhang, Ying (author), Benaiss, Aicha A. (author), van der Ham, Ineke J.M. (author), Bueno Perez, M.R. (author), Bidarra, Rafael (author)
In recent years, the use of Augmented and Virtual Reality (ARNR) has taken a larger role within training and education of various fields, but not every individual experiences the benefits that AR and VR technology are thought to provide. The perspective taking skill of an individual may be a good indicator of the effectiveness that AR and VR...
conference paper 2022
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Lu, Zhiwei (author), Li, Xiaoling (author), Wei, Jinxiu (author), Cai, Miao (author), Yang, Daoguo (author), Zhang, Kouchi (author)
UVC-LED is known as a deep ultraviolet LED. The application development and disinfection efficiency of UVC-LED modules are important problems encountered when UVC-LED products are rushed into commercialization. In this article, a specific disinfection experiment with a UVC-LED module was combined to analyze the disinfection efficiency. UVC-LEDs...
conference paper 2022
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Lv, Guoping (author), Yan, Haidong (author), Yan, Haidong (author), Yang, Daoguo (author), Wu, Xinke (author), Sheng, Kuang (author), Liu, Chaohui (author), Zhang, Yakun (author), Zhang, Kouchi (author)
As a key heat-dissipating and electrical interconnecting component in high-temperature power modules, die-attach and substrate-attach layers play an important role in effectively reducing the thermal resistance and improving the long-term reliability. Traditional substrate-attach materials limit the high-temperature applications of packaging...
conference paper 2022
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Zhang, X. (author), Kaczmarek, M.B. (author), Hassan HosseinNia, S. (author)
In this paper, we introduce a new representation for open-loop reset systems. We show that at steady-state a reset integrator can be modelled as a parallel interconnection of the base-linear system and piece-wise constant nonlinearity. For sinusoidal input signals, this nonlinearity takes a form of a square wave. Subsequently, we show how the...
conference paper 2022
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Tan, C. (author), Wang, S. (author), Liu, X. (author), Jiang, Jing (author), Zhang, Kouchi (author), Ye, H. (author)
On the basis of the development and application requirements of flexible DC transmission techniques, a 1 kA/10 kV half-bridge IGBT press-pack module is studied. The module is composed of three subunits in series, and each subunit consists of IGBT chips in parallel. In order to solve the problem of chips failure caused by non-uniform rigid...
conference paper 2022
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Zhang, H. (author), Cruz, Luis (author), van Deursen, A. (author)
The popularity of machine learning has wildly expanded in recent years. Machine learning techniques have been heatedly studied in academia and applied in the industry to create business value. However, there is a lack of guidelines for code quality in machine learning applications. In particular, code smells have rarely been studied in this...
conference paper 2022
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Pascual Laguna, A. (author), Bueno Lopez, J. (author), Yates, S.J.C. (author), Ferrari, Lorenza (author), Murugesan, Vignesh (author), Thoen, David (author), Dabironezare, Shahab Oddin (author), Zhang, H. (author), Llombart, Nuria (author), Baselmans, J.J.A. (author)
A focal plane array of extended-hemispherical silicon lenses coupled to aluminum coplanar-waveguide (CPW) Microwave Kinetic Inductance Detectors (MKIDs) has been designed to operate at 7.8 THz. Low-dispersive leaky-wave radiation has been used to efficiently illuminate the antireflection-coated lenses. To minimize the radiation loss from the...
conference paper 2022
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Zhang, L. (author), Babaie, M. (author)
Digital beamforming receivers (RXs) support MIMO operation and offer great flexibility and accuracy in multi-beam formation and calibration. However, compared with analog phased-array and hybrid systems, due to the absence of any rejection for spatial in-band blockers, the RX/ADC dynamic range and linearity should be high enough to prevent...
conference paper 2022
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Ji, Liangzheng (author), Zhang, Kouchi (author), Zhang, Jing (author), Liu, Pan (author)
Micro LED display technology has been spotlighted as the most promising technology compared to LCD and OLED. Its excellent advantages include higher brightness, self-illumination, higher resolution, lower power consumption, faster response, higher integration, higher stability, thinner thickness, longer life, etc. In terms of the unique benefits...
conference paper 2022
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Gao, Hanyan (author), Zhang, Jing (author), Zhu, Yingcan (author), Guo, Ruiqian (author), Zhang, Wanlu (author), Zhang, Kouchi (author), Liu, Pan (author)
With the trend of miniaturization and the increasing power density, the operating temperature of electronic devices keeps climbing, especially for wide band-gap semiconductors such as silicon carbide and gallium nitride. The high operating temperature up to 250℃ brings challenges to encapsulation materials since traditional encapsulation...
conference paper 2022
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Zhang, Feiran (author), Broz, F. (author), Dertien, Edwin (author), Kousi, Nefeli (author), Van Gurp, Jules A.M. (author), Ferrari, Oriana Isabella (author), Malagon, Ignacio (author), Barakova, Emilia I. (author)
There is growing interest in psychological interventions using socially assistive robots to mitigate distress and pain in the pediatric population. This work seeks to address the deficit in understanding of what features and functionality young children and their parents desire to help with pain management by using co-design, a common...
conference paper 2022
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Zhang, X. (author), Valle Torre, M. (author), Specht, M.M. (author)
Our life is surrounded by digital devices. Engineering education is one of the cornerstones in higher education for future generations and computational thinking (CT) is deemed as a core component in various engineering curricula. The Delft University of Technology (TU Delft), is the largest technical university in the Netherlands and computing;...
conference paper 2022
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Zhang, Zijian (author), Setty, Vinay (author), Anand, A. (author)
We introduce SparCAssist, a general-purpose risk assessment tool for the machine learning models trained for language tasks. It evaluates models' risk by inspecting their behavior on counterfactuals, namely out-of-distribution instances generated based on the given data instance. The counterfactuals are generated by replacing tokens in...
conference paper 2022
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Ji, X. (author), van Zeijl, H.W. (author), Romijn, J. (author), van Ginkel, H.J. (author), Liu, X. (author), Zhang, Kouchi (author)
The continuous trend to integrate more multi-functions in a package often involves, Heterogeneous Integration of multi-functional blocks in some kind of 3D stacking. The conventional flip chip for die-on-substrate technology applies solder for integration. However, solder joint integration has the disadvantages of restricting height, reflow...
conference paper 2022
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Novoa Munoz, Mauricio (author), Howell, Bryan F. (author), Hoftijzer, J.W. (author), Rodríguez Díaz, José Manuel (author), Zhang, Wendy (author), Kramer, Nikolaj (author)
Digital technologies have enabled design sketching to expand into new applications and domains. Inevitably, these new forms of visualisation require re-evaluating how we use drawing to see, visualise, understand, and fabricate products and services in design education and the profession. This paper presents a selection of discoveries after...
conference paper 2022
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