- document
-
Tang, J. (author), Gruber, D. (author), Schelen, J.B.J. (author), Funke, H.J. (author), Beenakker, C.I.M. (author)Decapsulation of a SOT23 semiconductor package with 23 um copper wire bonds is conducted with an especially designed microwave induced plasma system. It is found that a 30%-60% CF4 addition in the O2/CF4 etchant gas results in high molding compound etching rate. Si3N4 overetching which is encountered in plasma decapsulation is solved by an...journal article 2012
- document
-
Tang, J. (author), Schelen, J.B.J. (author), Beenakker, C.I.M. (author)Plastic integrated circuit packages with copper wire bonds are decapsulated by a Microwave Induced Plasma system. Improvements on microwave coupling of the system are achieved by frequency tuning and antenna modification. Plasmas with a mixture of O2 and CF4 showed a high etching rate around 2 mm3/min. The role of O2 and CF4 in etching molding...journal article 2011