Tuning of a cavity in a silicon photonic crystal by thermal expansion of an elastomeric infill

We use an elastomer as infill material for a photonic crystal. As a result of the thermal-expansion-induced strongly negative thermal optical coefficient, this material is highly suitable for thermal tuning of the transmission of a cavity. This is demonstrated by global infilling of a hole-type silicon photonic crystal slab and global thermal...

A piezo-thermal probe for thermomechanical analysis

Thermomechanical analysis (TMA) is widely used to characterize materials and determine transition temperatures and thermal expansion coefficients. Atomic-force microscopy (AFM) microcantilevers have been used for TMA. We have developed a micromachined probe that includes two embedded sensors: one for measuring the mechanical movement of the...

Polymer constraint effect for electrothermal bimorph microactuators

The authors report on the analysis of the polymer constraint effect and its use for a micromachined electrothermal bimorph actuator. The actuated displacement is enhanced due to the polymer constraint effect. Both the thermal expansion and apparent Young’s modulus of the constrained polymer blocks are significantly improved, compared with the no...

Powerful polymeric thermal microactuator with embedded silicon microstructure

A powerful and effective design of a polymeric thermal microactuator is presented. The design has SU-8 epoxy layers filled and bonded in a meandering silicon (Si) microstructure. The silicon microstructure reinforces the SU-8 layers by lateral restraint. It also improves the transverse thermal expansion coefficient and heat transfer for the...

Stress gradients in CrN coatings

Stress in hard films is the net sum of tensile stress generated at the grain boundaries, compressive stress due to ion peening, and thermal stress due to the difference in thermal expansion of the coating and substrate. The tensile part due to grain boundaries is thickness dependent. The other two contributions are not thickness dependent....

Tensile stress in hard metal films

Thin films on substrates are usually in a stressed state. An important, but trivial, contribution to that stress stems from the difference in thermal expansion coefficient of substrate and film. Much more interesting are the intrinsic stresses, resulting from the growth and/or microstructure of the film. Intrinsic compressive stress was...