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Online Condition Monitoring Methodology for Power Electronics Package Reliability Assessment
Training Convolutional Neural Networks with Confocal Scanning Acoustic Microscopy Imaging for Power QFN Package Delamination Classification
Heterogeneous Integration of Diamond Heat Spreaders for Power Electronics Application
Microstructure Analysis Based on 3D reconstruction Model and Transient Thermal Impedance Measurement of Resin-reinforced Sintered Ag layer for High power RF device
In-situ reliability monitoring of power packages using a Thermal Test Chip
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