A new hermetic sealing method for ceramic package using nanosilver sintering technology

A stochastic process based reliability prediction method for LED driver

A probabilistic physics-of-failure reliability assessment approach for integrated LED lamps

Interfacial properties of Cu/SiO2 using a multiscale modelling approach in electronic packages

Thermal Management on IGBT Power Electronic Devices and Modules

Transaction costs (TCs) in green building (GB) incentive schemes: Gross Floor Area (GFA) Concession Scheme in Hong Kong

Decoupled textures for broadband absorption enhancement beyond Lambertian light trapping limit in thin-film silicon-based solar cells

LED-Based Luminaire Color Shift Acceleration and Prediction

Reliability Prediction of Integrated LED Lamps with Electrolytic Capacitor-Less LED Drivers

Numerical thermal analysis and optimization of multi-chip LED module using response surface methodology and genetic algorithm

A novel lifetime prediction for integrated LED lamps by electronic-thermal simulation

Color Shift Failure Prediction for Phosphor-Converted White LEDs by Modeling Features of Spectral Power Distribution with a Nonlinear Filter Approach

Costs and Benefits of Implementing Green Building Policy

Photometric and colorimetric assessment of LED chip scale packages by using a step-stress accelerated degradation test (SSADT) method

Prediction of Lumen Depreciation and Color Shift for Phosphor-Converted White Light-Emitting Diodes Based on A Spectral Power Distribution Analysis Method

A Reliability Prediction for Integrated LED Lamp with Electrolytic Capacitor-Free Driver

A PoF and statistics combined reliability prediction for LED arrays in lamps

Overdriving reliability of chip scale packaged LEDs: Quantitatively analyzing the impact of component

Modeling nonlinear moisture diffusion in inhomogeneous media

Multimodal schedule design for synchromodal freight transport systems