Micromechanical modeling of stress evolution induced during cure in a particle-filled electronic packaging polymer

Establishment of the coarse grained parameters for epoxy-copper interfacial separation

Atomistic coarse grained parameters were calculated from a non-equilibrium molecular dynamics simulation of the separation of an epoxy-copper interface. The methodology to determine the interaction energy and the equilibrium distance between the interfacial materials at a minimum energy is established. The traction-displacement relations of the...

Designing an Integrated Wearable System for Biosensing and Self-reporting of Stress

Stress is an important aspect of mental health which impacts on wellbeing. Wearable devices are increasingly used to help people deal with stress in daily life. However, most of the current applications focus on detecting and representing physiological data. In this paper we report on the design of an integrated wearable system composed of...

Effect of temperature and humidity on moisture diffusion in an epoxy moulding compound material

In this paper we propose a new multistep characterisation method to be able to map out the dependency of moisture diffusion parameters of a polymeric material over a range of temperature and humidity conditions in a limited amount of time. We do that by (1) using a moisture sorption analyser which can continuously monitor weight changes with...

Effect of printing parameters on interlayer bond strength of 3D printed limestone-calcined clay-based cementitious materials: An experimental and numerical study

For a single batch material, time intervals and nozzle standoff distances between two subsequent layers are two critical printing parameters that influence the mechanical performance of the printed concrete. This paper presents an experimental and numerical study to investigate the impacts of these printing parameters on the interlayer bond...