Molecular dynamics simulations on mechanical behaviors of sintered nanocopper in power electronics packaging

Junction temperature and luminous flux prediction for white LED array based on electrical-photo-thermal modeling

Unraveling the hydrogen sulfide aging mechanism on electrical-thermal–mechanical property degradation of sintered nanocopper interconnects used in power electronics packaging

Insights into sulfur and hydrogen sulfide induced corrosion of sintered nanocopper paste: A combined experimental and ab initio study

Investigating the Sintering Process and Mechanical Properties of Nano-copper Particles Coupling Particle Packing Modeling with Molecular Dynamics Simulation

High temperature viscoplastic deformation behavior of sintered nanocopper paste used in power electronics packaging: Insights from constitutive and multi-scale modelling

Effect of epoxy resin addition on properties and corrosion behavior of sintered joints in power modules serviced offshore

Machine learning assisted early anomaly detection of LEDs with spectral power distribution modeling

Study on Sintering Mechanism and Mechanical Properties of Nano-Cu based on Molecular Dynamics Simulation

Sintering mechanism of Ag nanoparticle-nanoflake: a molecular dynamics simulation

A Comprehensive Study on the Rejuvenation Efficiency of Compound Rejuvenators for the Characterization of the Bituminous Binder, Mortar, and Mixture

High-temperature nanoindentation characterization of sintered nano-copper particles used in high power electronics packaging

Microchannel Thermal Management System with Two-Phase Flow for Power Electronics over 500 W/cm²Heat Dissipation

Self-Healing Injectable Polymer Hydrogel via Dynamic Thiol-Alkynone Double Addition Cross-Links

Indentation hardness, plasticity and initial creep properties of nanosilver sintered joint

Effects of sintering pressure on the densification and mechanical properties of nanosilver double side sintered power module

Stress analysis of pressure-assisted sintering for the double-side assembly of power module

The effects of graphene stacking on the performance of methane sensor: A first-principles study on the adsorption, band gap and doping of graphene

Effect of Sintering Pressure on the Porosity and the Shear Strength of the Pressure-Assisted Silver Sintering Bonding

A new hermetic sealing method for ceramic package using nanosilver sintering technology