Molecular dynamics simulations on mechanical behaviors of sintered nanocopper in power electronics packaging

Unraveling the hydrogen sulfide aging mechanism on electrical-thermal–mechanical property degradation of sintered nanocopper interconnects used in power electronics packaging

Insights into sulfur and hydrogen sulfide induced corrosion of sintered nanocopper paste: A combined experimental and ab initio study

Investigating the Sintering Process and Mechanical Properties of Nano-copper Particles Coupling Particle Packing Modeling with Molecular Dynamics Simulation

Performance evaluation of ventilative cooling systems for buildings under different control parameters and strategies

Transient thermal measurement on nano-metallic sintered die-attach joints using a thermal test chip

High temperature viscoplastic deformation behavior of sintered nanocopper paste used in power electronics packaging: Insights from constitutive and multi-scale modelling

Spatial Resolution Matching of Microwave Radiometer Measurements Using Iterative Deconvolution with Close Loop Priors (ICLP)

Study on Sintering Mechanism and Mechanical Properties of Nano-Cu based on Molecular Dynamics Simulation

Air infiltration and related building energy consumption: A case study of office buildings in Changsha, China

A Series of Ternary Metal Chloride Superionic Conductors for High-Performance All-Solid-State Lithium Batteries

High-temperature nanoindentation characterization of sintered nano-copper particles used in high power electronics packaging

Driving factors of land surface temperature in urban agglomerations: A case study in the pearl river delta, china

New innovations in pavement materials and engineering: A review on pavement engineering research 2021

The aging effect in evolving scientific citation networks

Low power AlGaN/GaN MEMS pressure sensor for high vacuum application