Simulation, Prediction, and Verification of the Corrosion Behavior of Cu-Ag Composite Sintered Paste for Power Semiconductor Die-attach Applications

With the popularization of wide band-gap power modules in offshore wind power systems and water surface photovoltaic power stations, packaging materials face challenges of corrosion by salt, blended with high humidity. Copper-silver (Cu-Ag) composite sintered paste was proposed by researchers as a novel die-attach material for a lower cost...