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Microscopic fracture toughness of notched porous sintered Cu micro-cantilevers for power electronics packaging
High temperature viscoplastic deformation behavior of sintered nanocopper paste used in power electronics packaging: Insights from constitutive and multi-scale modelling
Using knowledge graphs and deep learning algorithms to enhance digital cultural heritage management
Luminous performances characterization of YAG: Ce3+ phosphor/silicone composites using both reflective and transmissive laser excitations
基于Lambert-Beer理论与人工神经网络的混合荧光粉发射光谱预测
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