Electromigration-induced local dewetting in Cu films

Effect of Passivation and Mechanical Constraint on Electromigration in Interconnect

Implementation of Fully Coupled Electromigration Theory in COMSOL

Effect of Thermomigration on Electromigration in SWEAT Structures

Interfacial properties of Cu/SiO2 using a multiscale modelling approach in electronic packages

Implementation of General Coupling Model of Electromigration in ANSYS

Interfacial Failure Characterization of Electronic Packaging Component Using a Multiscale Modelling Approach

Multi-parameters optimization for electromigration in WLCSP solder bumps

Al(OH)3 facilitated synthesis of water-soluble, magnetic, radiolabelled and fluorescent hydroxyapatite nanoparticles

Numerical simulation on the mechanical characteristics of double-stranded DNA under axial stretching and lateral unzipping

Effects of temperature and grain size on diffusivity of aluminium: electromigration experiment and molecular dynamic simulation

The effect of riboflavin on the microbiologically influenced corrosion of pure iron by Shewanella oneidensis MR-1

Adaptive bidirectional extracellular electron transfer during accelerated microbiologically influenced corrosion of stainless steel

Vanadium-Containing Chloroperoxidase-Catalyzed Versatile Valorization of Phenols and Phenolic Acids

Effects of Defect and Temperature on the Mechanical Performance of WS₂: A Multiscale Analysis

Sulfur-Rich Ageing Mechanism of Silicone Encapsulant Used in LED Packaging: An Experimental and Molecular Dynamic Simulation Study

Directed evolution of phosphite dehydrogenase to cycle noncanonical redox cofactors via universal growth selection platform

Chemoenzymatic Hunsdiecker-Type Decarboxylative Bromination of Cinnamic Acids

A stochastic process based reliability prediction method for LED driver

The interface adhesion of CaAlSiN₃: Eu²⁺ phosphor/silicone used in light-emitting diode packaging: A first principles study